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Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/131309
Kind Code:
A1
Abstract:
The present invention suppresses accumulation of heat. An elastic wave device according to the present invention is provided with: a supporting substrate; a piezoelectric layer which contains lithium niobate or lithium tantalate, while being arranged in a first direction that is the thickness direction of the supporting substrate and having a main surface in the first direction; a cavity part that is provided between the supporting substrate and the piezoelectric layer; an IDT electrode which is arranged on the main surface of the piezoelectric layer, while comprising a first bus bar and a second bus bar, which face each other, a plurality of first electrode fingers each having a base end that is connected to the first bus bar, and a plurality of second electrode fingers each having a base end that is connected to the second bus bar; a wiring electrode which is arranged on the main surface of the piezoelectric layer, while being connected to the IDT electrode; and a highly heat conductive film which is provided within the piezoelectric layer in the first direction, while having a thermal conductivity higher than the thermal conductivity of the piezoelectric layer. At least a part of the IDT electrode is provided in a region that overlaps with the cavity part when viewed in plan in the first direction; the highly heat conductive film is provided in a region that overlaps with the cavity part when viewed in plan in the first direction; and at least one of the IDT electrode and the wiring electrode is connected to the highly heat conductive film directly or via a metal.

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Inventors:
INOUE KAZUNORI (JP)
Application Number:
PCT/JP2021/046375
Publication Date:
June 23, 2022
Filing Date:
December 15, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145; H03H9/25
Domestic Patent References:
WO2016147687A12016-09-22
WO2018105201A12018-06-14
Foreign References:
JP2019205164A2019-11-28
JP2015002511A2015-01-05
JP2010109949A2010-05-13
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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