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Patent Searching and Data


Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/140327
Kind Code:
A1
Abstract:
This elastic wave device comprises: a supporting board including a supporting member and a junction layer provided on the supporting member; a piezoelectric layer provided on the junction layer; a function electrode provided on the piezoelectric layer; and a moisture-resistant film layer. The supporting board has a cavity provided at such a position that the cavity is overlain by a portion of the function electrode in the stacking direction of the supporting member, the junction layer and the piezoelectric layer. The junction layer has a recess that is provided at such a position that the recess is overlain by the portion of the function electrode in the stacking direction and that constitutes the cavity together with the piezoelectric layer. The recess sinks in the direction approaching the supporting member from the surface of the junction layer opposed to the piezoelectric layer. The moisture-resistant film layer covers the junction layer including the side surfaces and bottom surface of the recess.

Inventors:
INOUE KAZUNORI (JP)
MIMURA MASAKAZU (JP)
IYAMA AKIHIRO (JP)
Application Number:
PCT/JP2023/001541
Publication Date:
July 27, 2023
Filing Date:
January 19, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
WO2016147687A12016-09-22
Foreign References:
JP2008178126A2008-07-31
JP2019091992A2019-06-13
US20210119595A12021-04-22
US20200350891A12020-11-05
JP2021536158A2021-12-23
JP2018133615A2018-08-23
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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