Title:
ELECTRIC CIRCUIT BOARD AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2020/027183
Kind Code:
A1
Abstract:
In this electric circuit board in which metal plates serving as a wire material are joined to an insulating substrate by a brazing material, discharging between the adjacent wires on the insulating substrate and creeping-up of the brazing material to the wires are suppressed in order to narrow gaps between wires. An electric circuit board 10 is provided with: an insulating substrate 1; and first and second metal plates 121, 122 which are joined to the insulating substrate 1 by a brazing material 3. A side surface 21 of the first metal plate 121 has an opposing surface 21a opposed to a side surface 21 of the second metal plate 122, and the opposing surface 21a has a region in which a groove 24 extends roughly parallel to a joined surface.
Inventors:
KONISHI YOSHITADA (JP)
Application Number:
PCT/JP2019/029969
Publication Date:
February 06, 2020
Filing Date:
July 31, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/13; H01L23/12; H01L23/36; H01L25/07; H01L25/18; H05K3/20
Foreign References:
| JP2017174927A | 2017-09-28 | |||
| JP2014027151A | 2014-02-06 | |||
| JP2016152385A | 2016-08-22 | |||
| JP2017011216A | 2017-01-12 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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