Title:
ELECTRIC COMPONENT EMBEDDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/082987
Kind Code:
A1
Abstract:
In this electric component embedded structure, a first electrode terminal provided on a first principal surface includes intra-region terminals, and the intra-region terminals are electrically connected to overlapping parts of overlapping wires inside an electronic component forming region. As a result, a reduction in the mounting area of the electric component embedded structure is achieved. The intra-region terminals can be electrically connected, through a first via conductor, the overlapping wires, and a second via conductor, to a second electrode terminal provided on a second principal surface. The intra-region terminals are connected to wires (overlapping wires) on a first insulated layer without additionally providing a rewiring layer which leads to an increase in thickness, whereby an increase in thickness is suppressed and a miniaturized electric component embedded structure is achieved.
Inventors:
MORITA TAKAAKI (JP)
YOSHIDA KENICHI (JP)
TOMIKAWA MITSUHIRO (JP)
YOSHIDA KENICHI (JP)
TOMIKAWA MITSUHIRO (JP)
Application Number:
PCT/JP2018/039748
Publication Date:
May 02, 2019
Filing Date:
October 25, 2018
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01L23/12; H01L25/00; H05K3/46
Foreign References:
| JP2007258542A | 2007-10-04 | |||
| JP2015185812A | 2015-10-22 | |||
| JP2007096273A | 2007-04-12 | |||
| JP2010080671A | 2010-04-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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