Title:
ELECTRIC COMPONENT MOUNTING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/211976
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electric component mounting board having a novel structure with which the occurrence of insufficient solder can be reduced or eliminated even when through-hole mounting is performed in a solder reflow mounting step. The electric component mounting board is provided with: a printed board 12 provided with through-holes 48, 50; and an electric component 16 having soldered portions 38a to c, 42 protruding therefrom. The soldered portions 38a to c, 42 of the electric component 16 mounted on one surface 14 of the printed board 12 are passed through the through-holes 48, 50 and soldered. First lands 54 are provided around the opening portions of the through-holes 48, 50 on one surface 14 side of the printed board 12. The first lands 54 have an outer diameter greater than second lands 56 provided around the opening portions of the through-holes 48, 50 on the other surface 46 side of the printed board 12.
Inventors:
YANOGAWA ISAO (JP)
Application Number:
PCT/JP2018/017445
Publication Date:
November 22, 2018
Filing Date:
May 01, 2018
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
H05K3/34; H01R12/72; H05K1/18
Foreign References:
| JP2005057114A | 2005-03-03 | |||
| JP2012069397A | 2012-04-05 |
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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