Title:
ELECTRIC COPPER PLATING LIQUID AND ELECTRIC COPPER PLATING PROCESS THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/219797
Kind Code:
A1
Abstract:
The present invention relates to an electric copper plating liquid and an electric copper plating process thereof. The electric copper plating liquid comprises the following components: 20g/L to 240g/L of copper sulfate pentahydrate, 20 g/L to 300 g/L of sulfuric acid, 25 g/L to 120 mg/L of chlorine ions, 0.1 mg/L to 20 mg/L of a brightening agent, 1 mg/L to 2000 mg/L of inhibitor, and the balance of deionized water, the brightening agent being selected from alkyl thiol sulfonate or two of derivatives thereof, and the inhibitor being selected from one or more of nonionic surfactants. The electric copper plating liquid in the present invention can greatly improve a plating current and greatly improves the throwing power (TP) of the plating a through hole of a flexible board, the TP is higher than 200%, an electric copper plating layer in each hole is flat, and the quality satisfies various requirements of the flexible board.
Inventors:
WANG CHONG (CN)
PENG JIA (CN)
CHENG JIAO (CN)
XIAO DINGJUN (CN)
HE WEI (CN)
PENG JIA (CN)
CHENG JIAO (CN)
XIAO DINGJUN (CN)
HE WEI (CN)
Application Number:
PCT/CN2017/084621
Publication Date:
December 28, 2017
Filing Date:
May 17, 2017
Export Citation:
Assignee:
GUANGDONG GUANGHUA SCI-TECH CO LTD (CN)
International Classes:
C25D3/38; C25D5/10; C25D7/00
Domestic Patent References:
| WO2002055568A2 | 2002-07-18 |
Foreign References:
| CN102071443A | 2011-05-25 | |||
| CN105441993A | 2016-03-30 | |||
| CN1918327A | 2007-02-21 | |||
| CN101004402A | 2007-07-25 | |||
| CN104499021A | 2015-04-08 | |||
| EP1091024A1 | 2001-04-11 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
Download PDF:
Previous Patent: VIDEO SERVICE CONTROL METHOD, MOBILE TERMINAL, AND SERVICE SERVER
Next Patent: ROOF COMPRISING SOLAR BATTERY ASSEMBLY
Next Patent: ROOF COMPRISING SOLAR BATTERY ASSEMBLY