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Patent Searching and Data


Title:
ELECTRIC REDUNDANT CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2014/087316
Kind Code:
A1
Abstract:
Electronic circuit, for allowing at least one current to flow between at least two points of the same circuit. Said electronic circuit is in contact with a structure (P) and comprises at least one graph (2) including a plurality of nodes (24) and a plurality of connections or branches (22) between said nodes (24) that create at least one mesh (M) of interconnections. Said at least one mesh (M) comprises a plurality of interconnections, which are so configured that between two nodes (24) there are at least two interconnections, created by means of said plurality of connections or branches (22).

Inventors:
VERCELLESI MARCO FRANCESCO (IT)
Application Number:
PCT/IB2013/060557
Publication Date:
June 12, 2014
Filing Date:
December 02, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ALENIA AERMACCHI S PA (IT)
International Classes:
H05K1/02; B64D15/12; F02C7/045; F02C7/047; H05B3/00
Foreign References:
US6137083A2000-10-24
EP1060645A12000-12-20
US7923668B22011-04-12
US3216089A1965-11-09
Other References:
None
Attorney, Agent or Firm:
VITILLO, Giuseppe (C.so Vittorio Emanuele II 61, Torino, IT)
Download PDF:
Claims:
CLAIMS :

1. Electronic circuit, for allowing at least one current to flow between two points of the same circuit;

said electronic circuit is in contact with a structure (P) and comprises at least one graph (2) including a plurality of nodes (24) and a plurality of connections or branches

(22) between said nodes (24) that create at least one mesh

(M) of interconnections;

characterized in that said at least one mesh (M) comprises a plurality of interconnections, which are so configured that between any two nodes (24) there are at least two interconnections, created by means of said plurality of connections or branches (22) .

2. Circuit according to claim 1, wherein said mesh (M) has a random topography.

3. Circuit according to claim 1, wherein said mesh (M) has a structured topography.

4. Circuit according to at least one of the preceding claims, wherein said plurality of connections or branches (22) and said plurality of nodes (24) are created with a laminar structure.

5. Circuit according to claim 4, wherein it is a printed circuit .

6. Circuit according to claim 4 or 5, wherein it is a multilayer circuit.

7. Circuit according to at least one of the preceding claims, wherein said plurality of connections or branches (22) have all the same electric characteristics.

8. Circuit according to claim 1 or 7, wherein said plurality of connections or branches (22) have such electric characteristics as to emit heat when run by electric current, for the purpose of heating said structure (P) .

9. Circuit according to claim 1 or 7, wherein said plurality of connections or branches (22) have such characteristics as to allow conduction of a plurality of electric signals between a transmitter and a receiver.

10. Circuit according to claim 1, wherein said structure is a soundproof panel (P) for aircraft application.

11. Circuit according to claim 10, wherein said panel (P) comprises a plurality of holes (F) arranged according to a predetermined layout and obtained when assembling the parts comprised in the panel itself.

Description:
TITLE: ELECTRIC REDUNDANT CIRCUIT

The present invention relates to a solid-state electronic circuit placed in contact with a structure. The circuit, which comprises a plurality of redundant connections or branches and nodes, is intrinsically resistant to interruptions of a plurality of interconnections between the nodes, thereby preserving the continuity and functionality of the circuit even in the presence of multiple single interruptions of connections or branches of the same circuit. Continuity and functionality of the circuit are ensured in a high percentage of cases, approx. 99.99%.

Such circuits may have many applications depending on the structure with which they are associated, in particular placed in contact.

The circuits according to the present invention can be associated with panels, e.g. soundproof panels.

Said soundproof panels find application in the aeronautics field.

Soundproof panels are generally formed by multiple layers (sandwich), and comprise two surfaces or skins and one spacer element. Said spacer normally has a honeycomb structure. The surface exposed to the air flow is perforated, in a manner such that a Helmholtz resonator is obtained in each honeycomb cell.

Generally, these soundproof panels are not heated. Generally, during the flight mission these panels are subject, whether directly or indirectly, to icing.

The evolution of the requirements concerning icing severity and soundproofing anticipated by the flight safety bodies urges to create soundproof panels which are heated, for example, by electronic circuits capable of resisting to interruptions caused by panel perforation. In particular, difficulties are encountered in ensuring continuity of the electric circuit following the panel perforation operations .

The electronic circuits included in soundproof panels, such as, for example, heating elements, are normally buried in a rolled carbon sheet.

The present invention aims at solving the above- mentioned technical problems by providing a redundant circuit directly in contact with the structure with which said circuit is associated.

One aspect of the present invention relates to a redundant circuit placed directly in contact with the structure, having the features set out in the appended independent claim 1.

Auxiliary features of the circuit are set out in the appended dependent claims.

The features and advantages of the circuit according to the present invention will become apparent from the following description of different embodiments thereof and from the annexed drawings, wherein:

• Figures 1A and IB show two different embodiments of the circuit according to the present invention; Figure

1A shows a redundant circuit with random topography, whereas Figure IB shows a circuit with structured topography;

• Figures 2A and 2B show the circuits of Figure 1 in contact with the structure with which they are associated, wherein on said structure there are a plurality of interruptions with different topographies;

• Figure 3 shows a path followed by current flowing in circuit 2A after the interruptions;

· Figure 4 shows a panel with which a redundant circuit has been placed in contact, in accordance with the present invention.

With reference to the above-mentioned drawings, the solid-state electronic circuit for allowing at least one current to flow between at least two points of the same circuit is in contact with a structure "P", as can be seen, for example, in Figures 2A and 2B.

For the purposes of the present invention, the term "solid-state electronic circuit" refers to a circuit comprising physical components only, such as solid-state communication means and/or supports, in particular wherein the signal is not transmitted via radio waves or wireless means. The phrase "in contact with a structure "p"" means that said circuit is in direct contact with said structure, e.g. secured to a surface thereof or buried in it, e.g. buried in a preferably composite structure.

The circuit comprises at least one graph 2 including a plurality of nodes 24 and a plurality of connections or branches 22 between said nodes 24 that create at least one mesh "M" of interconnections.

For the purposes of the present invention, the term "graph" refers to a discrete structure wherein the arcs are the connections or branches and the nodes are the interconnection nodes between the various connections or branches . For the purposes of the present invention, the term "mesh" refers to at least one closed electric path in which an electric current can flow.

Said at least one mesh "M" comprises a plurality of connections or branches 22, which are so configured that any two nodes 24 are interconnected via at least two paths created by means of said connections or branches 22. The electric circuit is redundant because there are a plurality of paths for conducting an current between any two nodes 24.

In a first embodiment, e.g. as shown in Figure 1A, said graph 2, in particular said mesh "M", has a random topography .

For the purposes of the present invention, the term "random topography" means that the topographic arrangement of nodes 24 and/or the length of connections or branches 22 and/or the number of connections or branches 22 reaching a single node 24 is not constant and regular.

In a second embodiment, e.g. as shown in Figure IB, said graph 2, in particular said mesh "M", has a structured topography .

For the purposes of the present invention, the term "structured topography" means that the topographic arrangement of nodes 24 and the length of connections or branches 22 and the number of connections or branches 22 reaching a single node 24 is predetermined, constant and regular .

The choice of implementing one embodiment or the other also depends on the shape and nature (random or structured) and the distribution (probabilistic or deterministic) of the damages suffered by structure "P", which damages may cause interruptions in the circuit.

The damages suffered by structure "P" may be holes intentionally made in order to create a function, e.g. an acoustic one, of the panel, or formed during the service life of the structure itself.

The topography of the circuit according to the present invention allows arranging said circuit in contact with the structure with any orientation, e.g. with respect to the longitudinal and transversal directions of the structure itself, while still preserving its characteristic of obtaining at least one current path even after a plurality of interruptions on graph 2, as shown by way of example in Figures 2A and 2B. In these drawings, the orientation of the circuit does not follow the directrices of the structure, e.g. longitudinal and transversal.

When the circuit is interrupted because of a random or predetermined distribution of damages in structure "P", the same circuit will have a smaller number of interconnections between nodes 24 than the initial one, due to interruption of various branches or connections 22 and various nodes 24. The efficiency and functionality of the circuit will be ensured with a given probability. Therefore, with a certain probabilistic level, there will be one or more electric current paths that will have survived the interruptions. Said surviving circuits will allow at least one current to flow, thus ensuring the functionality of the circuit. Figure 3 highlights a path for current "I" which has survived the interruptions.

In the preferred embodiment, said plurality of connections or branches 22 and said plurality of nodes 24 are created with a laminar structure, more preferably such that graph 2 has a laminar shape.

For the purposes of the present invention, the term "laminar shape" means that the thickness of graph 2 is negligible compared with its longitudinal and transversal extension, thus forming, for example, a substantially two- dimensional structure.

In one embodiment of the circuit according to the present invention, said circuit is a printed circuit.

For the purposes of the present invention, the term

"printed circuit" refers to one or more layers of insulating material on which a plurality of tracks of conductive material are laid, which are adapted to form at least one portion of graph 2, or a physical support, e.g. a textile or non-textile one, on which a plurality of tracks of conductive material are created, which are adapted to form a portion of graph 2, e.g. by metallization or photoengraving of parts thereof.

More in detail, said printed circuit is a multilayer circuit .

In an alternative embodiment, said circuit is made of conductive material, with a laminar structure which is laid like a carpet in the structure of composite material while manufacturing structure "P" itself. In the preferred embodiment, the circuit is buried in carbon fibre. In the present embodiment, structure "P" is made of composite material, comprising carbon fibre.

In an alternative embodiment, the circuit has a single-layer or multilayer laminar structure. In these two last embodiments, the laminar structure performs a self- bearing function and requires no physical support. The circuit of the present invention can be manufactured by engraving and/or deposition or pressing.

In a preferred embodiment, said plurality of connections or branches 22 have all the same electric characteristics.

For the purposes of the present invention, the term "electric characteristics" means that each connection or branch 22 has predetermined dimensional and physical characteristics, such as thickness and width, that give it known electric properties, e.g. equivalent resistance and conduction .

A first possible application of the circuit according to the present invention is as a heating element. In the present embodiment, said plurality of connections or branches 22 have such electric characteristics as to emit heat when run by electric current, for the purpose of heating said structure "P". In this application, the width and material used are optimal to allow conduction and irradiation of heat in order to warm up that portion of structure "P", with which the circuit has been placed in contact, which surrounds the circuit itself. The material chosen for branches 22 is such that it allows the utmost heat conduction and/or the utmost efficiency in generating heat through the Joule effect, as is known to the man skilled in the art. The circuit according to the present invention is implemented in so-called "anti-icing" or "de- icing" systems.

A second possible application of the circuit according to the present invention is as a communication line. In the present embodiment, said plurality of connections or branches 22 has such electric characteristics as to allow conduction of a plurality of electric signals between a transmitter and a receiver.

In this application, the electric characteristics of the connections or branches must be such that they can be correctly coupled to the transmission and reception devices, in particular ensuring, for example, a known characteristic impedance.

In this type of application, the circuit can conduct an electric signal, including data, or electric energy for powering one or more electric devices, e.g. sensors or actuators, located in the proximity of structure "P" with which the circuit has been placed in contact. The circuit can thus be used as an element for conducting electric energy and/or an electric and/or electronic signal useful for managing and/or controlling sensors and/or actuators.

Said structure "P" is a structural or covering element of a device, such as, for example, an aircraft, a vehicle or a boat .

Said structure may be an internal element of the aircraft or an external element.

In the preferred embodiment, structure "P" is a panel, e.g. a soundproof panel. Panel "P" is, for example, adapted for aircraft application. Said panel is preferably applied in air intakes and/or nacelles of airplanes, which contain systems such as, for example, engines or tanks.

Said panel is preferably at least partly made of composite material.

One example of embodiment of the panel is shown in Figure 4. Figure 4 shows, in fact, a soundproof panel. Said panel "P" comprises two surfaces or skins (pi, p2) and at least one spacer element "p3". Preferably, said at least one spacer element "p3" has a honeycomb structure.

Said panel "P" comprises a plurality of holes "F" arranged according to a predetermined or random layout, and made after assembling the parts comprised in the panel itself .

A first surface "pi" of the panel "P", exposed to the air flow, comprises said plurality of holes "F", in a manner such that a Helmholtz resonator is obtained in each cell of the honeycomb. A second surface "p2" is not perforated .

The distribution of the holes on said panel "P" may have a structured or regular topography, wherein, for example, the distance between the various holes is in the range of 5 to 20 mm, the hole having a diameter of 1 to 4 mm. In an alternative embodiment, the panel may have a hole distribution with random topography.

The adoption of redundant electric circuits, which are intrinsically resistant to interruptions, reduces the problems relating to the positioning of the circuit, e.g. used as a heating element, on a structure, e.g. a panel that will have to be perforated.

The present invention ensures low-cost production of the same circuits and of structure "P" with which the circuit is to be placed in contact, even following damages suffered by the structure itself.

The use of redundant circuits placed in contact with structure "P" allows to meet the safety requirements, e.g. concerning aircraft appendices, proposed in the EASA CS25 Regulations for anti-icing protection. In the preferred embodiment, the present invention transforms the soundproof panel comprised in a nacelle into a part protected from icing.

The use of the circuit according to the present invention allows to create anti-icing systems by implementing a solution wherein the water captured by the air intake is kept in the liquid state up to the engine inlet and is then processed by the engine, resulting in higher energetic efficiency, unlike prior-art solutions in which all the water captured by the air intake is transformed into gaseous phase. Furthermore, systems can be created which implement a solution wherein a part of the water is transformed into gaseous phase and the remaining part is managed in relation to the ice ingestion limits of the engine.

The use of redundant electric circuits with any topography and material, whether supported or not, single- layer or multilayer, constituting a laminar layer fastened to the structure or integrated into a structure to be re- processed and/or damaged, e.g. by perforation, allows solving the above-mentioned problems whenever said reprocessing or damage involves the risk of interrupting the connections of said circuits.

REFERENCE NUMERALS:

Graph 2

Connections or branches 22

Nodes 24 Holes F

Current path I

Mesh M

Structure/panel P

First surface or skin pi Second surface p2

Spacer p3