Title:
ELECTRICAL BUS WITH ASSOCIATED POROUS METAL HEAT SINK AND METHOD OF MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO2004079792
Kind Code:
B1
Abstract:
A module (18,16) is formed in which semiconductor components are soldered to an electrically conductive heat sink(16).The electrically conductive heat sink(16) is formed so that it will serve as an electrical bus(22) in an electronic device. The chips of the semiconductor coomponenets are metallurgically bonded to the surface of the heat sink (16).The heat sink(16) uses a heat transfer fluid that flows through an interior of the heat containing an internal element(24).In the preferred embodiment, the internal element is a plurality of silver plated copper balls(24). The copper balls (24) are brazed to each other and to the walls of the heat sinks in an assembly process. The heat sink housing will typically be made from copper, with one surface made from molybdenum so that the expansion and contraction of the heat sink housing (161) molybdenum surface will be similar to that of the silicon substrate of the chips, thereby avoiding the problem of the chip substrate cracking and breaking due to thermal flexing.
Inventors:
JOSEPH CRAIG (US)
ARNOLD KELLY W (US)
DORSCH JAMES T (US)
EVANS ANTHONY C (US)
ARNOLD KELLY W (US)
DORSCH JAMES T (US)
EVANS ANTHONY C (US)
Application Number:
PCT/US2004/006489
Publication Date:
August 04, 2005
Filing Date:
March 03, 2004
Export Citation:
Assignee:
UNITED DEFENSE LP (US)
JOSEPH CRAIG (US)
ARNOLD KELLY W (US)
DORSCH JAMES T (US)
EVANS ANTHONY C (US)
JOSEPH CRAIG (US)
ARNOLD KELLY W (US)
DORSCH JAMES T (US)
EVANS ANTHONY C (US)
International Classes:
B21D53/02; B23K31/02; F28F7/00; H01L25/04; H02M7/00; H05K7/14; H05K7/20; H01L; (IPC1-7): B21D53/02; B23K31/02; F28F7/00
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