Title:
ELECTRICAL COMPONENT AND METHOD FOR MANUFACTURING ELECTRICAL COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2011/001737
Kind Code:
A1
Abstract:
Provided is a method for manufacturing electrical components, said method comprising a step in which a middle plating layer comprising palladium or a palladium alloy is formed on top of a substrate, and a step in which a surface plating layer comprising tin or a tin alloy containing metals other than palladium is formed on top of the middle plating layer. This allows the provision of an electronic component having a surface layer comprising mainly tin, whereby whisker formation is inhibited over a long period of time even if the component is under stress.
Inventors:
TAKAMIZAWA MASAO (JP)
NAKA TOSHIHIDE (JP)
KEMMOTSU HITOSHI (JP)
NISHIMURA YOSHIYUKI (JP)
NAKA TOSHIHIDE (JP)
KEMMOTSU HITOSHI (JP)
NISHIMURA YOSHIYUKI (JP)
Application Number:
PCT/JP2010/057697
Publication Date:
January 06, 2011
Filing Date:
April 30, 2010
Export Citation:
Assignee:
OM SANGYO CO LTD (JP)
TAKAMIZAWA MASAO (JP)
NAKA TOSHIHIDE (JP)
KEMMOTSU HITOSHI (JP)
NISHIMURA YOSHIYUKI (JP)
TAKAMIZAWA MASAO (JP)
NAKA TOSHIHIDE (JP)
KEMMOTSU HITOSHI (JP)
NISHIMURA YOSHIYUKI (JP)
International Classes:
C25D7/00; C25D5/10; C25D5/12
Foreign References:
| JP2003129278A | 2003-05-08 | |||
| JPS57103342A | 1982-06-26 | |||
| JP2002076229A | 2002-03-15 |
Attorney, Agent or Firm:
NAKATSUKASA, SHIGEKI (JP)
Shigeki Nakamu (JP)
Shigeki Nakamu (JP)
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