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Patent Searching and Data


Title:
ELECTRICAL COMPONENT SOCKET
Document Type and Number:
WIPO Patent Application WO/2020/008934
Kind Code:
A1
Abstract:
Provided is an IC socket (11) in which: contact pins (14) to be contacted with and separated from the terminals of an IC package (12) are disposed in a socket body (13); opening and closing bodies (19A, 19B) equipped with pressing members (23a, 23b) for pressing the upper surface of the IC package (12) accommodated on an accommodating surface portion (16d) of the socket body (13) are rotatably provided on the socket body (13); and a manipulation member (20) for opening and closing the opening and closing bodies (19A, 19B) is disposed so as to be movable up and down with respect to the socket body (13). The first opening and closing body (19A), which has a heatsink (23a) for pressing the entire upper surface of the IC package (12), and the second opening and closing body (19B), which has a block (23b) for pressing the heatsink (23a), are disposed at mutually different positions.

Inventors:
UEYAMA YUKI (JP)
Application Number:
PCT/JP2019/024954
Publication Date:
January 09, 2020
Filing Date:
June 24, 2019
Export Citation:
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Assignee:
ENPLAS CORP (JP)
International Classes:
H01R33/76
Foreign References:
JP2016051644A2016-04-11
JPS5145516Y21976-11-04
Attorney, Agent or Firm:
SANO, Hiroshi (JP)
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