ELECTRICAL CONNECTION CONNECTOR AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2020/138882

A1

Provided is a connector located between a test device and a device to be tested so as to electrically connect the test device with the device to be tested. The connector is stacked in a vertical direction and has first and second conductive sheets capable of conducting in the vertical direction. The first conductive sheet includes an insulating material and can perform conduction in the vertical direction. The second conductive sheet includes the insulating material and can perform conduction in the vertical direction. The first and second conductive sheets are stacked and bonded so as to be capable of performing conduction in the vertical direction. The bonding is formed through chemical bonding between molecules of the insulating materials of the first and second conductive sheets.

CHUNG YOUNG BAE (KR)

PCT/KR2019/018285

July 02, 2020

December 23, 2019

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ISC CO LTD (KR)

G01R1/073; B32B37/14; G01R1/04; G01R1/067; G01R3/00

KR20060123910A	2006-12-05
KR20070102716A	2007-10-19
US6942941B2	2005-09-13

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LIMOR PASTERNAK ,YARON PAZ: "Low-temperature direct bonding of silicon nitride to glass", RSC ADVANCES, vol. 8, no. 4, 9 January 2018 (2018-01-09), pages 2161 - 2172, XP055722340, DOI: 10.1039/C7RA08854J

CHANG, Duck Soon et al. (KR)

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