Title:
ELECTRICAL CONNECTION STRUCTURE, ARRAY SUBSTRATE AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/016153
Kind Code:
A1
Abstract:
An electrical connection structure, an array substrate and a display device. The electrical connection structure (01) comprises a first electrical connection component (10), which comprises: a conductive structure (11); an insulating layer (12) covering the conductive structure (11) and provided with a first via hole (12a) and a second via hole (12b) which are respectively exposed from a part of the surface of the conductive structure (11), wherein an opening size (W1) of the first via hole (12a) is larger than an opening size (W2) of the second via hole (12b); and a conductive connection layer (13) covering the first via hole (12a) and the second via hole (12b) and electrically connected to the conductive structure (11) via the first via hole (12a) and the second via hole (12b). The electrical connection structure (01) can reduce an undercutting phenomenon occurring at a via hole in the insulating layer (12).
Inventors:
LIU LIPING (CN)
YIN WENXIANG (CN)
AI YU (CN)
HAN JUNQI (CN)
YIN WENXIANG (CN)
AI YU (CN)
HAN JUNQI (CN)
Application Number:
PCT/CN2015/098268
Publication Date:
February 02, 2017
Filing Date:
December 22, 2015
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
G02F1/1345
Foreign References:
| CN101907791A | 2010-12-08 | |||
| CN202710888U | 2013-01-30 | |||
| CN102998869A | 2013-03-27 | |||
| JP2008015373A | 2008-01-24 |
Other References:
See also references of EP 3333624A4
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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