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Patent Searching and Data


Title:
ELECTRICAL CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2015/056554
Kind Code:
A1
Abstract:
This electrical connection structure (10) is provided with a first metal member (11) which contains copper or a copper alloy and at least a part of which has a tin plating layer (11A) formed thereon, a second metal member (12) which is electrically connected to the first metal member (11), and a surface treatment layer (14) which is formed on the surface of the first metal member (11). The surface treatment layer (14) is formed by coating with a surface treatment agent that contains a base oil and a compound with metal affinity that has a lipophilic group and an affinity group having affinity to metal. The compound with metal affinity contains (a) an adduct of an acidic alkyl phosphate ester and an azole compound, and (b) an adduct of an acidic alkyl phosphate ester and a metal and/or organic amine compound.

Inventors:
NOMURA HIDEKI (JP)
HIRAI HIROKI (JP)
ONO JUNICHI (JP)
OOTSUKA TAKUJI (JP)
HOSOKAWA TAKEHIRO (JP)
HASE TATSUYA (JP)
NAKASHIMA KAZUO (JP)
GOTO KAZUHIRO (JP)
MIZOGUCHI MAKOTO (JP)
Application Number:
PCT/JP2014/075793
Publication Date:
April 23, 2015
Filing Date:
September 29, 2014
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
UNIV KYUSHU NAT UNIV CORP (JP)
International Classes:
H01R4/62; B32B15/20; H01B7/00; H01B7/28; H01R13/03
Foreign References:
JP2013235716A2013-11-21
JP2012054170A2012-03-15
JP2000015743A2000-01-18
JPH07249445A1995-09-26
JPH10302866A1998-11-13
JP2006176870A2006-07-06
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
Patent business corporation dawn joint patent firm (JP)
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