ELECTRICAL CONTACT MATERIAL FOR CONNECTOR, METHOD FOR PRODUCING SAME, AND ELECTRICAL CONTACT FOR CONNECTOR

WIPO Patent Application WO/2012/147506

A1

Provided is a technique for producing an electrical contact material for a connector whereby stable contact resistance is maintained over a long period and the insertion force during terminal insertion is sufficiently small, and which has excellent electrical reliability and durability and yet is also inexpensive. A method for producing an electrical contact material for a connector comprises: a metal layer formation step for forming atop a substrate a metal layer comprising Ni, Sn, Al, Zn, Cu, In, or an alloy thereof; an oxide layer removal step for removing an oxide layer formed after the metal layer formation step; and an electroconductive oxide layer (or electroconductive hydroxide layer) formation step for performing an oxidation treatment (or hydroxylation treatment) on the surface of the metal layer from which the oxide layer has been removed, to form an electroconductive oxide layer (or electroconductive hydroxide layer). An electrical contact material for a connector, in which a metal layer comprising Ni, Sn, Al, Zn, Cu, In, or an alloy thereof is formed atop a substrate and an electroconductive oxide layer or an electrocondcutive hydroxyide layer is formed atop the metal layer.

SAWADA SHIGERU (JP)

PCT/JP2012/059715

November 01, 2012

April 09, 2012

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AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SAWADA SHIGERU (JP)

C23C28/00; C23C8/02; C23C8/10; C25D5/10; C25D5/12; C25D5/48; C25D5/50; C25D7/00; H01R13/03

JP2000164279A	2000-06-16
JP2008124048A	2008-05-29
JP2006111898A	2006-04-27
JP2011026677A	2011-02-10

JODAI, Tetsuji et al. (JP)
Tetsuji Ueshiro (JP)

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