ELECTRICAL CONTACT AND SOCKET FOR ELECTRICAL COMPONENT

Title:

ELECTRICAL CONTACT AND SOCKET FOR ELECTRICAL COMPONENT

Document Type and Number:

WIPO Patent Application WO/2017/033795

Kind Code:

A1

Abstract:

In the present invention, a socket body in which an IC package is contained is provided with a contact pin 32, and is electrically contacted with a connection terminal of the contained IC package. The contact pin 32 has a plurality of layers laminated on the surface of a base material 62 having electrical conductivity, specifically: an under layer 64 formed as an Ni plating layer over the base material 62; a first surface layer 68 formed as a Pd-Ni alloy plating layer over the under layer 64; a second surface layer 70 formed as an Ni plating layer over the first surface layer 68, in which the speed at which the Sn of the connection terminal diffuses is slower than with a conventional Ag plating layer; and an outermost surface layer 72 formed as an Au plating layer over the second surface layer 70 and serving as an electrical contact layer.

Inventors:

ODA TAKAHIRO (JP)

Application Number:

PCT/JP2016/073875

Publication Date:

March 02, 2017

Filing Date:

August 16, 2016

Export Citation:

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Assignee:

ENPLAS CORP (JP)

International Classes:

H01R13/03; G01R1/073; G01R31/26

Foreign References:

JP2013221166A	2013-10-28
JP2004192861A	2004-07-08

Other References: