Electrical Induced Forward Transfer

Aryeh Batt by Photon Jet Ltd

Field of the Invention

This invention generally pertains to the field of digital manufacturing, material printing and material distribution. More specifically the invention relates to new systems, devices and methods of electrical - induced forward transferring [hereinafter "EIFT" , SL-EIFT & LD EIFT], enabling 2D, 3D or 4D printing of various materials; enabling distribution of a plurality of materials and high resolution patterning and a comprehensive printing solution.

Background of the Invention

Conventional methods of printing as ink jet and screen printing have limitations of feature size and even more critical limitations of the scope of materials that can be printed in a repeatable, sustainable manor and widi controlled quality.

There are many printing processes in the industry diat are conducted over several sets of equipment thus limiting simplicity, accuracy, and quality of the printed platform. The integration between such systems is expensive from the aspect of resources and processes required to achieve adequate results. These patterning and printing methods are also limited

Methods of LIFT are well known in research and in the industry. LIFT was first reported in fill in the art. It consists of a transparent substrate coated with a thin film of the transferred material die "donor", the donor is facing the receiver substrate, the "acceptor". A laser pulse locally induces a thermal excitation that finally results in material transfer towards the acceptor.

The LIFT method can be used to transfer a rather large number of different materials, e.g. copper, nickel, aluminum, and chrome. In recent years laser transfer of liquid droplets was investigated both theoretically and experimentally with special emphasis on bio-materials, The main problem of LIFT technology, essentially used in academic research center, is the complexity of the LIFT system, including (i) the Laser manipulation; fiij the donor holding and supplying. This invention overcome this inconvenience and complexity and brings LIFT means and method to industrial use.

Printing solutions and specifically industrial printing solutions are executed in many stages as material preparation, exposure and patterning, drying, sintering and other. In existing solutions diese various activities are performed on various types of equipment in a production line. This invention further brings a comprehensive solution that equips several technologies built to be integrated on a single platform.

Brief Summary of the Current Invention

The present invention discloses a patterning, printing and material distribution system, characterized by: one or more printing heads, each of which comprising at least one distributer which distributes material in an electrical induced forward transfer (EIFT) substrate-less EIFT (SL- EIFT) method; Local Donor EIFT (LD-EIFT) method; one or more material reservoirs, each of which contains or in connection widi at least one material to be fed by said printing head in a continuous manner; and one or more energy sources in connection with said one or more reservoirs; at least one energy source is adapted to generate said EIFT process. The present invention further discloses a mediod of patterning, printing and material distributing by means of said system.

The present invention discloses a patterning, printing and material distribution system, as defied above, wherein said energy source is selected from a group consisting of materials that on current flow generate thermal energy.

The present invention discloses a deposition, patterning, printing and material distribution system, as defied in any of the above, wherein energy operation parameters are selected from a group consisting of PW, PRE, power, pulse shape and other parameters can be controlled. The present invention further discloses a method of depositing, patterning, printing and material distributing by means of said system. The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein the energy source is distributed to several energy sources emerged in the reservoir, and acts each as an individual jetting apparatus.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein die energy is distributed by an energy distribution mechanism that distributes the energy to at least one location and at a time division or power division mechanism.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein at least one electric arc receives power from a signal generator diat controls parameters of the power; said parameters are selected from a group consisting of energy, pulse duration and frequency.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein at least one resisting element receives power from a signal generator which controls parameters of the power, said parameters are selected from a group consisting of energy, pulse duration and frequency.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein a sequence of a member of a group is selected from pulses, PWs and PRRs is generated to receive adequate distributing parameters according to the application, material and process.

The present invention discloses a depositing, printing and material distribution system, as defied in any of the above, wherein said member selected from a group consisting of energy source, that is at least partially coated with a hydrophobic coating thereby eliminating residue material on the energy distributor.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein an intermediate layer of thermal conducting material is added to the end of the energy source, improving the jetting properties and varying the scope of materials. The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein a member of a group selected from an energy source, an electrical arc and resisting element is vertically translated thereby controlling the distance between the energy source and the surface of the material.

The present invention discloses a printing and material distribution system, as defied in any of the above, wherein a member of a group selected from an energy source, an electrical arc or resisting element, is vertically translated and operates in one or more of four different positions, namely feedback position , printing position, refresh position and filling position.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein a member of a group selected from an energy source, an electrical arc and resisting element, is vertically translated and operating a printing sequence of the following steps of providing an energy pulse from energy source; forming a vapor bubble in the material of the reservoir; facilitating the travel or odierwise traveling a vapor bubble via the material and reaches the surface; and refreshing the surface and providing tt to be ready for the next energy pulse.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein the material in the reservoir acts as a substrate in addition to being the jetted material.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein the dimensions of the opening of the reservoir are either fixed or adaptable; said opening is adapted to be closed altogether and thereby support the filling process.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein die opening of the reservoir is adapted to be close to support the process of filling by either the adaptable opening mechanism or by die plug connected to the energy element.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of die above, wherein the reservoir walls are heated by an electrical current. The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein the reservoir is cooled by a member of a group consisting of thermo-electric cooler, heat pipes and any other mechanism adapted to achieve longer shelve life of the material.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of die above, wherein the material is heated by a member a group selected from of thermo-electric module, heat pipes and any other mechanism adapted to achieve longer shelve life of the material.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of die above, wherein said energy source is a member selected from a group consisting of a CW laser, pulsed laser, any odier mechanism adapted to heat the material locally in the reservoir.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein at last a portion of the walls of the reservoir and/or its opening is coated by a hydrophobic material, or is a wetted by a wetting layer, or treated by elevated or reduced temperature thereby surface shape parameters are controlled.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of die above, utilizable in one or more steps of a group consisting of printing, filling, cleaning and patterning.

The present invention discloses a depositing, printing and material distribution system, as defied in any of the above, wherein the energy source is an energy source, an electrical arc or resisting element .

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein the energy parameters are selected from a group consisting of PW, PRF, Power, and pulse shape.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein a member of a group selected from an energy source, that is vertically translated thereby controlling the distance between the energy source and the surface of die material.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein a member of a group selected from energy source, is vertically translated and operates in one or more of four different positions, namely feedback position , printing position, refresh position and filling position.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein said apparatus is utilized in an integrated printing head system, said system comprising; multiple reservoirs and at least one energy source in each reservoir; multiple energy sources; multiple central reservoirs with at least one material; a feedback, calibration and synchronization mechanism; and, an adjustable mounting mechanism.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein a feedback mechanism supports the calibration, synchronization, alignment and process control of the system.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein alignment screws enable 0y , θζ and θχ alignment.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of the above, wherein a sensor acquires a printed target diat has been printed on a different system or a target printed by this system in the same session.

The present invention discloses a depositing, patterning, printing and material distribution system, as defied in any of die above, comprising a sensor which measures die dimensions of the printing and give feedback to process control and/or to sintering or curing system.

The present invention discloses a multi material cartridge EIFT system that depositing, patterning, printing and material distribution system, as defied in any of the above, widi a static EIFT head and a disposable or refillable cartridge of 1,2,3, 10, 100 etc. material reservoirs of the same or different materials. Brief Description of the Drawings

In order to better understand the invention and its implementation in practice a plurality of embodiments will now be described, by way of non-limiting example only, with reference to accompanying drawings herein

Figure 1 schematically illustrates the conventional LIFT process;

Figure 2 schematically illustrates the basic EIFT process

Figure 3 schematically illustrates the multi-point EIFT process

Figure 4 Schematically illustrates an additional multi point EIFT process

Figure 5 schematically illustrates the substrate less EIFT (SL EIFT) , Local Donor (LD EIFT) mechanism;

Figure 6 Relates to the five steps of the SL EIFT material distribution method;

Figure 7 is an example of an energy profile, not limiting, that can improve the distribution and droplet properties;

Figure 8 schematically illustrates a method of a high speed printing process by translating the energy source vertically;

Figure 9 schematically illustrates a system with a multi head system;

Figure 10 schematically illustrates feedback mechanisms added on to a printing head;

Figure 11 schematically illustrates the interfaces between the system's entities and external to the system;

Figure 12 schematically illustrates the basic sequences of the printing process;

Figure 13 schematically illustrates die more complex system sequences;

Figure 14 schematically illustrates the calibration process of the multi-technology head;

Figure 15 schematically illustrates the modules comprising die multi-technology head comprising;

Figure 16 schematically illustrates the sintering and patterning heads where in more detail; Figure 17 schematically illustrates a full system approach comprising the multitechnoiogy components;

Figure 18 schematically illustrates the mechanisms of the sintering;

Figure 19 schematically illustrates the local donor EIFT concept

Figure 20 schematically illustrates a multi material cartridge EIFT concept.

Detail Description of the Preferred Embodiments

The following description is provided alongside all chapters of the present invention so as to enable any person skilled in the art to make use of said invention and sets fordi the best modes contemplated by the inventor of carrying out this invention. Various modifications, however, will remain apparent to those skilled in the art, since the generic principles of the present invention have been defined specifically to provide printing heads, systems, devices and methods of LIFT, enabling 2D ,3D or 4D printing of various materials; enabling distribution of a plurality of materials and high resolution patterning and a comprehensive printing solution.

In addition to the invention of the single head substrate-less EIFT, diree system concepts are designed in the relation to the printing concept. The first concept is related to a multi-head device where the device is comprised of a plurality of heads; e.g., 1, 2, 3, 10; 100 etc.; and the system can be comprises a plurality of multi-head devices, e.g., 1, 2, 3, 10; 100 etc. The second concept is a system related and combined of at least two of the four basic technologies defined above, combining or otherwise integrating diem in to a single apparatus. Printing and distributing various materials need additional processes that in current existing equipment are done in several machines. A combined or otherwise integrated printing head of at least two of the above provides a comprehensive solution. The third concept is a EIFT static head with multi-point EIFT positions with a disposable or refillable cartridge of a plurality of materials According to one embodiment of the invention, a system is disclosed, wherein one or more materials are jetted on the required substrate at specific dimensions. If required, access material can be removed, textured, processed or patterned to a predefined size and shape utilizing predefined retrievable data. According to yet another embodiment of the invention, a method of jetting and otherwise processing the material is disclosed.

According to another embodiment of the invention, a system is disclosed, wherein other treatments to the material is activated by e.g., the 3 ^rd or 4 ^!h component of the combined head, thus completing a full printing process. According to yet another embodiment of the invention, a method of completing a full printing process is disclosed.

According to another embodiment of the invention, a system is disclosed, wherein the later processes sequence is swapped, based on the material and the required process. According to yet another embodiment of the invention, a method of swapping is disclosed. The term 'swapping' refers hereinafter to selecting one sequence of operation steps from two or more different sequences of steps.

According to another embodiment of the invention, the system comprises a plurality of the aforesaid combined heads mounted and controlled on a system built from an x-y-z stage and an adjustable bridge. According to yet another embodiment of die invention, a method of producing, assembling and using said combined heads is disclosed.

According to another embodiment of the invention, a printing system is provided. This printing system is based on SL-EIFT and/or LD EIFT and/or EIFT of various materials and pattern the material on the acceptor with a laser-based patterning head. The said printing system is furdier adapted for patterning the material; e.g., by means of trimming, disconnecting or other means of changing the jetted material shape. According to yet another embodiment of the invention, a mediod of producing, assembling and using said SL-EIFT and/or LD EIFT and/or EIFT systems is disclosed.

According to another embodiment of the invention, a printing system is provided. This printing system is based on SL-EIFT and/or LD EIFT and/or EIFT of various materials and it is adapted to be useful for drying and sintering the material with a laser-based sintering head and/or a curing head. According to yet another embodiment of the invention, a method of producing, assembling and using said drying and sintering SL-EIFT and/or LD EIFT and/or EIFT systems is disclosed.

According to another embodiment of the invention, a printing system is provided. This printing system is based on SL-EIFT and/or LD EIFT and/or EIFT of various materials and sinter it is adapted to be useful for drying the jetted material in a single process. According to yet another embodiment of the invention, a method of producing, assembling and using said SL-EIFT and/or LD EIFT and/or EIFT systems is disclosed.

According to another embodiment of die invention, a printing system is provided. This printing system is based on SL-EIFT and/or LD EIFT and/or EIFT of various materials and it is adapted to be useful for combining or otherwise integrating two or more technologies selected, in a non-limited manner, from a group comprising inter alia: patterning, curing and sintering in various sequences such as jetting, sintering, patterning or jetting patterning sintering or jetting, curing, patterning and any other possible sequence(s) and any combination diereof. According to yet another embodiment of the invention, a method of producing, assembling and using said drying and sintering SL-EIFT and/or LD EIFT and/or EIFT systems for combining or otherwise integrating two or more technologies is disclosed.

According to another embodiment of die invention, a printing system is provided. This printing system is based on SL-EIFT and/or LD EIFT and/or EIFT of various materials and it is adapted to be useful for combining or otherwise integrating two or more technologies selected, in a non-limited manner, from a group comprising inter alia: patterning, curing and sintering utilizing a feedback mechanism, such as a sensor, array of sensors, cameras, a source and detector, and any other feedback mechanism(s) and any combination thereof. According to yet another embodiment of the invention, a method of producing, assembling and using said drying and sintering SL-EIFT and/or LD EIFT and/or EIFT systems for combining or otherwise integrating two or more technologies is disclosed.

According to another embodiment of the invention, a printing system is provided. This printing system is based on SL-EIFT and/or LD EIFT and/or EIFT of various materials adapted useful for one or more members of a group comprising, inter alia, utilizing calibrating, registering and synchronizing methods and combination thereof adapted to provide high resolution and accuracy of die printing system, According to yet anodier embodiment of the invention, a method of producing, assembling and using said drying and sintering SL-EIFT and/or LD EIFT and/or EIFT systems for calibrating, registering and synchronizing is disclosed.

According to another embodiment of the invention, another system is provided. This system comprising at least one mechanism selected in a non-limited manner from a group comprising inter alia sintering, curing, patterning and a combination thereof, adapted to be utilized with other printing technologies, such as inkjet, screen printing, or exposure based patterning systems. According to yet another embodiment of the invention, a method of producing, assembling and using said drying and sintering SL-EIFT and/or LD EIFT and/or EIFT systems for sintering, curing, patterning is disclosed.

According to anodier embodiment of the invention, another EIFT-type system is provided. This system comprises (i) at least one reservoir, at least one of said reservoirs at least partially filled by a material, (ii) at least one energy source, said light source is selected in a non-limiting manner form one or more members of a group comprising inter alia: one or more lasers; one or more heating filaments; any other suitable mechanism and applicable means adapted to bring a required energy into said reservoir at a required location; and any combination diereof. According to yet another embodiment of die invention, a method of producing, assembling and using said drying and sintering SL-EIFT and/or LD EIFT and/or EIFT systems for storing in a reservoir and utilizing an energy source is disclosed.

According to anodier embodiment of the invention, anodier EIFT-type system is provided. In this system, energy required to displace the material from a reservoir is an energy distributed by a resisting metal inserted in the material at a precise predefined distance from the surface. According to yet another embodiment of the invention, a method of producing, assembling and using said EIFT system and utilizing the energy in such a manner is disclosed.

According to another embodiment of the invention, another EIFT-type system is provided. In this system, energy source is moved in a z-axis by a piezoelectric, magnetic, micro electromechanical system (MEMS), or any other useful mechanism. According to yet another embodiment of the invention, a method of producing, assembling and using said EIFT-type system with a movable energy source is disclosed.

According to another embodiment of the invention, another EIFT-type system is provided. In this system, one or many energy sources are located in one or more reservoirs, in one or more x- y-z locations in the reservoirs. According to yet another embodiment of the invention, a method of producing, assembling and using said EIFT-type system with a plurality movable energy sources is disclosed.

According to another embodiment of the invention, another EIFT-type system is provided. In this system, energy in die waveguide, or aforesaid other applicable mechanisms, is operated or manipulated along one or more predefined, or otherwise feed backed sequences; such that at least one parameter selected in a non-limiting manner from a group comprising, inter alia: efficiency, throughput, accuracy, printing parameters such as adhesion and conductivity is significantly enhanced. According to yet another embodiment of the invention, a method of producing, assembling and using said EIFT-type system with enhanced operation characteristics is disclosed.

According to another embodiment of the invention, another EIFT-type system is provided. In this system, one or more energy sources or aforesaid other applicable mechanisms are translatable vertically in and out of a reservoir to improve throughput, printing quality and stability of printing process. According to yet another embodiment of the invention, a mediod of producing, assembling and using said EIFT-type system with translatable energy sources is disclosed.

According to another embodiment of the invention, anodier EIFT-type system is provided. In this system, one or more point energy sources receive energy from several energy sources of various parameters. These energy sources are selected in a non-limiting manner from a group comprising, inter alia: a continuous waveform (CW); a pulsed waveform; a pulsed profile of predefined or feed backed parameters with a pulsed waveform of other parameters; and any combination thereof. According to yet another embodiment of the invention, a mediod of producing, assembling and using said EIFT-type system having several energy sources is disclosed. According to another embodiment of the invention, another EIFT-type system is provided. In diis system, one or more waveguides receives energy from several energy sources of various parameters. These energy sources are a central waveform generator or energy source distributed to at least one reservoir and at least one printing head or a local waveform generator for each printing head of lower power for each printing head and such a waveform generator has controlled and gained energy by a gain mechanism. According to yet another embodiment of the invention, a method of producing, assembling and using said EIFT-type system having several energy sources is disclosed.

According to anodier embodiment of the invention, another EIFT-type system is provided. In this system, temperature of the reservoir(s) is controlled by a heating mechanism and/or by a thermoelectric heater/cooler, thus receiving adequate material properties for printing, shelf life improvement and process stability. According to yet another embodiment of the invention, a method of producing, assembling and using said EIFT-type system having reservoir's controlled cooling/heating mechanism is disclosed.

According to another embodiment of the invention, die aforesaid SL-EIFT and/or LD EIFT and/or EIFT systems are disclosed. These systems further comprise a cleaning mechanism, adapted to clean the said energy sources, diereby improving energy and printing efficiency and quality. According to yet another embodiment of die invention, a method of producing, assembling and using said systems having energy source's cleaning mechanism is disclosed.

According to another embodiment of the invention, the aforesaid SL-EIFT and/or LD EIFT and/or EIFT systems are disclosed. This system further comprises preventive mechanism. The preventive mechanism is selected in a non-limiting manner from a group comprising, inter alia: coating(s), wetting, rotation mechanism, and movement mechanism, e.g., movement mechanism on and of the energy source, thereby improving energy and printing efficiency and quality. According to yet another embodiment of the invention, a method of producing, assembling and using said systems having preventive mechanisms is disclosed.

According to another embodiment of the invention, the aforesaid SL-EIFT and/or LD EIFT and/or EIFT systems are disclosed. This system further comprises mechanisms for controlling or altering the surface shape of the material in the reservoir by mechanism selected in a non-limiting manner from a group comprising, inter alia: an electro-wetting, coating, heating of the reservoir's opening walls, and any combination thereof; thereby controlling the printing and distribution parameters. According to yet another embodiment of the invention, a method of producing, assembling and using said systems having mechanisms for controlling or altering the surface shape of the material is disclosed.

According to anodier embodiment of die invention, the aforesaid SL-EIFT and/or LD EIFT and/or EIFT systems are disclosed. This system further comprises a reservoir which is adapted to be filled widi die material in a manner which reduces or eliminates a need to disassemble or otherwise remove the printing head. According to yet another embodiment of the invention, a method of producing, assembling and using said systems having a reservoir adapted to reduce or eliminate a need to disassemble or otherwise remove the printing head is disclosed.

According to anodier embodiment of the invention, the aforesaid SL-EIFT and/or LD EIFT and/or EIFT systems are disclosed. This system further comprises fi) a reservoir; fii) a multi compartment reservoir(s); (in) more dian one reservoir; and/or (iv) a sequence or train of reservoirs diat are in fluid communication and fed by a one or more central reservoir with one or more different materials. According to yet another embodiment of the invention, a method of producing, assembling and using said systems having said main reservoir(s) and sub-reservoir(s) arrangements or array thereof, is disclosed.

According to another embodiment of the invention, die aforesaid SL-EIFT and/or LD EIFT and/or EIFT systems are disclosed. This system further comprises the said one or more reservoirs provided, in, in fluid communication, or on a single or a plurality of printing heads, The said reservoirfs) is or are fed by at least one central reservoir, and in addition, or alternatively, by reservoirs with one or more different materials. According to yet another embodiment of the invention, a method of producing, assembling and using said systems having said printing heads widi said main reservoir(s) and sub-reservoir(s) arrangements or array thereof, is disclosed.

According to another embodiment of the invention, the aforesaid SL-EIFT and/or LD EIFT and/or EIFT systems are disclosed. This system further comprises a mechanism of distributing energy from a central energy source to energy distribution mechanisms as defined above. The said energy distribution mechanism is provided according an embodiment of the invention as function of time and/or power. According to yet another embodiment of the invention, a method of producing, assembling and using said systems having a mechanism of distributing energy, is disclosed.

A comprehensive printing solution head is presented herein. The head is adapted to be mounted on a system in die same manor that an inkjet printing head is integrated in a printing system. The Multi-technology printing head is integrated in a system with accessories as lasers, material reservoirs, control and electronics systems, adjustable mechanical interface and other accessories needed to operate the system's technology heads. The multi technology head SW interfaces by a predefined ICD to the platform's software.

It is in the scope of the invention wherein a first multi technology head is disclosed. The multi technology head includes an SL EIFT and/or LD EIFT head with one or more of the following: another SL EIFT head, sintering head, patterning head, and UV curing head and any combination diereof.

In an EIFT printing system, the terms 'material' and 'donor' interchangeably refer inter alia to a substrate coated with a thin film, and the term 'acceptor' refers, inter alia, to a receiver substrate.

The mediods in the present invention are based on the physical phenomena of the standard LIFT material distribution. Reference is now made to Fig. 1, illustrating in a non-limiting and in an out-of-scale manner a system according to one embodiment of die invention: transparent substrate (1) coated with a thin film of the transferred material (3, die "donor"), the donor is facing the receiver substrate (7, the "acceptor"). A laser pulse (4) locally induces a diermal excitation that finally results in material transfer towards the acceptor. As illustrated in Fig. 1 the laser pulse generates localized energy and due to the temperature coefficient die heat is transferred fast and only at the focused point, a gas bubble (5) is generated. This gas bubble travels fast to the surface and injects a droplet (6) from die boundary of the material with the ambient.

Reference is now made to Fig. 2, illustrating in a non-!imiting and in an out-of-scale manner a system according to another embodiment of the invention: the material itself is used as the substrate of the donor. A reservoir (9) contains the printing material (10). An electronic resistance mechanism comprised from Metal i (8) with thermal properties:

d Metal 2 (11) with the thermal properties : or other effective energy source is placed at distance Dl from die border of the material, and the energy from the said energy source is brought to the precise position thus generating the gas bubble (5) in the material whilst using the material in the reservoir as die donor substrate.

Reference is still made to Fig. 2, illustrating in a non-limiting and in an out of scale manner a system according to another embodiment of the invention. An electrical energy pattern generator source (12) flows electrical current through metal 1 and metal 2 by connections (13) connected to metal 1. Typical current of several hundred niA generate printing temperature of several hundred degrees Kelvin.

Reference is now made to Fig. 3, illustrating in a non-limiting and in an out of scale manner a system according to another embodiment of the invention. Multiple energy sources 1 to n (16) are located in the reservoir (17) each energy source relates to a specific opening in the reservoir 1 to n (15). The energy source is located at a distance Dl from the material surface . the size of the Metal 2 is D3 and the opening in the reservoir is D4. Material is flowed between the energy sources and the openings directional as illustrated in (14).

Reference is now made to Fig. 4, illustrating in a non-limiting and in an out of scale manner a system according to another embodiment of the invention. Multiple energy sources 1 to n (19) are located in die reservoir (17) , all energy sources are aligned with a single opening in the reservoir (18) with an opening of D4.

Reference is now made to Fig. 5, illustrating in a non-limiting and in an out-of-scale manner a system according to another embodiment of the invention. An energy source described above (20) is submerged in printing material (22) and a stopper apparatus (23) may close the opening D4 to enable filing of the reservoir.

Reference is now made to Fig. 3, illustrating in a non-limiting and in an out-of-scale manner a system according to another embodiment of the invention, Here, the process is defined as tlie five steps SL-L1FT process. The printing refresh-time defines droplet ejection's frequency for a single waveguide. This refresh-time depends, inter alia, fi) on the material properties (e.g., its viscosity, its surface tension etc.) and (ii) on the waveguide parameters (dl, d3,).

Reference is now made to Fig. 6, illustrating in a non-limiting and in an out-of-scale manner a system according to another embodiment of the invention. Decrease of the refresh time is provided useful by applying a continuous current, or other heating mechanism, in addition to the electrical pulse of die printing, in order to provide local heating of tlie material before energy required for the printing. In this way one can locally reduce the viscosity and die surface tension of the liquid before the jetting. This process thus enables decreasing the refresh time of the material, and provides for an increasing in frequency. Moreover, throughput of the system increases and hence enables an additional degree of freedom in controlling the droplets volume.

Reference is still made to Fig. 5. In one embodiment of die invention, die printing head comprises an energy source with parameters D2 and D3. The energy parameters are controllable by a central mechanism, an electrical pulse generator connected to the arc and/or resistance element. All above embodiments can comprise additional or alternative energy source(s), such as a CW laser, electronic heater element or other may heat the material and thus set a viscosity level adequate for the required printing parameters. Control of Dl, Dl is a distance between energy source end tip and material surface, in one or all of the systems are characterized by an additional degree of freedom, in addition to the energy and viscosity, for fine tuning physical parameters such as droplet size and frequency of the process.

It is in the scope of die invention wherein reservoir (9) either (i) comprises of or (ii) is in connection with at least one heating and/or cooling mechanism. Heating of the material is useable to control the viscosity of the material. Likewise, a cooling mechanism utilizable to improve the shelf life of the material. The heating mechanism is preferably, yet not exclusively, selected from a group consisting of electrical filament, laser energy, current flowing through the reservoir walls and other effective mechanism. A cooling mechanism is preferably, yet not exclusively, selected from a group consisting of thermoelectric cooler such as a Peltier module, heat pipes, thermo regulating fluid flowing in reservoir walls and any other effective mechanism.

It is still in the scope of the invention wherein reservoir (9) is at least partially made by material or materials selected from a group consisting of plastics; metal ware, glass, composite materials, mixtures thereof and any other composition enabling printing of acid materials.

It is still in the scope of die invention wherein reservoir (9) is characterized by a predefined size and shape of opening (d4); and wherein the size and shape of said opening is changeable, adaptable, feed-back able or fixed. Such an adaptation enables controlling of the meniscus curvature and to correlate it to material's type, viscosity and various required printing parameters. Controlling of the meniscus curvature is achievable by electro-wetting of the walls, and/or heating of the material in e.g., one of the methods described above. It is still in the scope of the invention wherein a multiple energy sources are applied in a single reservoir; increasing thus the control of the meniscus curvature; thereby providing by means of each energy source an uniform droplet property.

Reference is still made to Fig. 8, underlining that step(s) of filing a material in to the reservoir is a process that is done with or witiiout a requirement of extracting the tube from the immediate location, in case it is implanted in situ, e.g., within the body or in online fluid communication with patient's organ. In an operating mode, vacuum in the reservoir controls the boundary of the surface with the ambient environment. It is further acknowledged that whilst filling, reservoir's opening is to maintained in its CLOSE configuration; see Figure 8 - filling position; so material won't flow out of the reservoir. Methods of closing die opening are based on e.g., control of switching OPEN configuration to CLOSE configuration by a plug (9a) connected to the energy source. Hence, vertical motion of the energy source, plugs the reservoir opening from OPEN configuration to CLOSE configuration. Other shutters are applicable, such as mechanical plugs, solenoids, and vacuum controllers.

It is in the scope of the invention wherein the aforesaid SL-EIFT device, in contrast to standard LIFT devices, is characterized by a throughput which is at least partially derived from a refresh rate, in addition to the laser PRR and other parameters. Refresh rate is controllable by the viscosity of the material, such as by heating, moving the energy source, applying electronic arc, or by any other effective energy transfer mechanism. It is further in the scope of the invention ^' wherein a mechanical movement, such as a stirring in a lateral movement, is to increase refresh rate.

It is in the scope of the invention wherein cleaning of the energy transfer module is required, since dirt, impurities, and residual material may accumulate and degrade the performance. Coating of the end tip with hydrophobic material, or shaping of the end, is potentially required as a preventive measure. Mechanical cleaning of the tip, by e.g., exerting the tip and brushing off access material with an automatic or semi-automatic mechanism based on the platform is advisable.

Reference is now made to Fig. 10, illustrating in a non-limiting and in an out-of-scale manner a printing head according to another embodiment of the invention. This set of one or more printing heads is mountable on a system and is design to interface a signal generator system (26); material main reservoir (27); electronics of die platform; control mechanism of die platform; and computer readable media and software thereof (SW)- Printing target (31a) is mounted on an x, y, z precision stage (31b) which brings the target accurately under the printing head. As there is a plurality of independent reservoirs, each head holds different material. A plurality of conductive lines is thereby printable in a predefined accurate orientation. Specific points of a non-conductive material are dien printable, e.g., in an orthogonal orientation, thus providing an x-y grid of printed lined provided on one platform and by a single process, Fig, 14, illustrating in a non-limiting and in an out-of-scale manner an example for that. Many different materials and layers are applicable. Hence for example, layers of different materials (material 1 to material N*) can be co-printed with or without complementary processes, such as patterning; sintering; curing, such as in Complex Sequence #1; various layers and various materials can be printed with complementary processes in between, as in Complex Sequence #2; and a combination as in Complex Sequence #3.

It is in the scope of the invention wherein system's mechanical interface of the system is an integrated module of the commercially available inkjet printing heads. Angle Θ defining the orientation towards the platform adjustable e.g., by means of a screw mechanism (28). Degrees of freedom are angles Oy and θζ. θχ is mechanically alignable due to larger tolerances. The mechanical interface enables interface, communication, compatibility and integration widi various different components of such a multi technology head; such as photon jet, patterning head, sintering head, UV curing head, diereby establishing an integrated multi technology head (IMTH). It is acknowledged that in systems were accuracy and resolution are less critical; such an IMTH is communicated or otherwise connected to the system in a static manner without or with less degrees of freedom for alignment.

It is in the scope of the invention wherein an electrical interface supplies power to the printing head, electronics and/or controls mirror(s), fiberfs), heating and cooling mechanisms, reservoir stop (opening's switchable member), power source etc. The interface is provided, e.g., via one or more connectors and it potentially comprises electrical signal(s), waveguide(s) and fiber(s) of the energy source.

It is in die scope of the invention wherein material flow to the head reservoir is controllable and provided by main reservoir (27) or alternatively, by reservoirs (27-31) of various materials. The system controls the flow. Filling of die reservoir is provided e.g., according to mechanism (9a) as illustrated in fig. 5 and fig. 8.

Reference is now made to Fig. 10, illustrating in a non-limiting and in an out-of-scale manner one or more feedback mechanisms according to another embodiment of the invention. Such a feedback mechanism is incorporated, integrated or communicated to a printing head. A sensor array, such as a CCD, CCMOS (32) or any other suitable array, photo-detector, quad detector or other power detector is mounted in, on or in connection with the head. An either positive or negative feedback mechanism with source (33); via waveguide (35); by means of a module located externally to the waveguide; by the energy source (34); or alternatively by one or more additional energy sources (34a) are incorporateable into the said system or head. It is furdier well in the scope of the invention wherein aforesaid feedback mechanism is utilizable for calibration and synchronization of die printing head and heads and process control of the printing process, for patterning process sintering process and for UV curing process.

Reference is now made to Fig. 1 1 , illustrating in a non-limiting and in an out-of-scale manner head's control systems according to another embodiment of the invention. The system controls printing head interfaces with system platform (45); and to the entities of die system control (46). The control system of the head receives pattern data & material data from the platform and transforms it to coordinates and to parameters that the printing head requires. Hence for a non-limiting example, the said parameters are selected from a group consisting of dimensions, locations and orientation of the lines, height, width, length shape and line space, material types and a mixture diereof, parameters required for defining patterning, sintering, UV curing and any combination thereof. The control system is furdier adapted to receive data from die aforesaid feedback mechanism to control the process and for tuning of printing parameters, such as speed, power, etc. Additionally or alternatively, die control system is furdier adapted to control one or member of group consisting inter alia: movement of energy source (42), scanning mirror, optics, cooling and heating's temperature, timing of cleaning, negative or positive feedback mechanisms and any combination thereof.

It is in the scope of die invention wherein calibration mechanisms adapted to calibrate the printing head to die system are based or utilizes feedback mechanisms. The term 'calibration' refers herein in a non-limiting manner to the accuracy and orientation of the head in the system; and to the calibration of the parameters of the head such as parameters related with energy power, electrical PW, PRF, heating and cooling temperatures speed of movement of the energy source etc. In the aforesaid system, calibration and registration targets are able to be pre-prepared on the printed platform, or printed by the jetting mechanism; and be acquired by die feedback mechanism as a sensor array, CCD , CMOS etc,

Sintering head

It is in die scope of the invention wherein the sintered is a printed material, and the sintering is geometrical dependent. The method of sintering comprises steps of monitoring and feedbacking the printed substrate, thereby on-line measuring levels of sintering of the material; and defining its physical dimensions. According an embodiment of the invention, a first pass of the head measures the geometrical properties of the printed lines. In feedback R(x,y) is computed vs Power (x,y) and energy source in the sintering head is initiated. The sintering power is controllable and has various wave forms; energy can be raised constantly, in a high rise time method or other wave form. In this way, sintering time and sintering quality of the printed line are optimized. Reference is now made to Fig. 16, illustrating in a non-limiting and in an out-of-scaie manner a system comprising at least two heads, one adapted form sintering and other for patterning. The system comprising energy source, scanning mechanism and optic system.

Reference is now made to Fig, 17, illustrating in a non-limiting and in an out-of-scaie manner a full SL EIFT and/or LD EIFT and/or EIFT system, sequence and mediod. The SL EIFT or LD EIFT or EIFT head prints patterns as 180, 180a and 180b, a feedback mechanism as 181, 182 and/or 176 which acquires the shapes printed on die acceptor (178). The coordinates of the shapes and dieir dimensions are related to a x,y location relative to the printed patterns (180, 180a, 180b) and relative to the x, y stage(179). The sintering, patterning or UV curing head (171), operates according to the feedback parameters, and by controlling energy source (170) and the scanning mechanism ( 173) and effective sintering, patterning and curing is achieved. The said feedback mechanism has a source (181) and detector (182) or a source and detector combined mechanism (176).

Reference is now made to Fig. 18, illustrating in a non-limiting and in an out-of-scale manner a sequence according to another embodiment of the invention. The sequence is provided in a non-limiting manner and defining one mode in of die sintering process. Data is receivable from feedback mechanism (190) and from various means of manufacturing data (191); by calculating (192) values obtained in a series of measurements; by prior knowledge of (i) material and (ii) dimensions that define a power function P(x, y) which is fed into the sintering mechanism. The values may further include parameters related to scanning, power, speed and odier process parameters (194).

Reference is now made to Fig. 19, schematically illustrating in a non-limiting and in an out-of-scale manner a printing head according to another embodiment of the invention. In the standard LIFT process described above, substrate (201) and material (202) are standard members. The improvement here is that even by reducing die size to a minimal dimension as shown in 205 and 206, a standard LIFT process continues to operate and to function. Embedding local donor (205) or embedding a plurality of local donors into reservoir (215) continues to support a standard LIFT mechanism, thus deriving a "local donor LIFT" mediod and systems diereof. Reservoir (215) incorporates a flow of material, thereby refreshing local donor (205) mechanism and enabling high frequency and continues printing. Replacing the Laser source of the standard LIFT with Metal 1(216) and Metal 2 (217) defines the operation of the EIFT process.

Patterning head

Dimensions of the feature of the printed material are obtainable by combining both processes of jetting and patterning. The process of jetting involves widi depositing a material on a substrate. This process is based on dimensions and patterns of the patterning head which removes die access material. The process comprises various steps, such as ablating of access material by, e.g., pulsating energy from an energy source, focusing and scanning it on the printed substrate. It is in the scope of die invention wherein the said process is basically sequenced as illustrated as described in figure 12.

UV Curing Head

It is known in die art that various materials and inks are cured by energy of UV wavelength. It is in die scope of the invention wherein the UV curing head is adapted to emit energy at a required predefined wavelength to cure these inks. A feedback mechanism and a previously obtained pattern data are both utilizable in emitting energy at a required location R(x,y). UV source is preferably selected from one or more members of a group, inter alia consisting of a UV diode, laser diode, UV lamp; and potentially be a part of an UV curing head (110a). Alternatively or additionally, it is distributable via a laser distribution mechanism (105).

Reference is now made to Fig. 15, illustrating in a non-limiting and in an outof-scale manner four (4) apparatuses, devices or systems that are combined to one printing solution, according to another embodiment of the invention. The head with four integrated mechanisms comprises, inter alia, one or more of following: an EIFT head (112): a laser patterning head (111); a laser sintering head (110); and an UV curing head (110a).

According to one embodiment of the invention, a jetting head based on substrate-less Electrical induced forward transfer (SL-EIFT) comprises one or more of the following: one or more pattering heads, one or more drying heads, one or more sintering heads and one or more UV curing heads. The combined apparatus acts as a single device and interfaces the system as one integrated mechanism. The energy, material, electronics, control and other feedings to the apparatus are the same in a single and a multi-head system. It is in the scope of the invention wherein die system comprises one or more jetting heads with patterning abilities, a jetting head widi sintering abilities; and a jetting head with patterning abilities and sintering head, combination with an UV curing head etc. A single or a plurality of energy sources is provided in the system according to the required application. Multiple material feeders of different substances are incorporable in the system according to a required application,

It is in the scope of the invention wherein an energy distribution mechanism is utilized and supports distribution of required energy. It is also in the scope of the invention wherein a mechanical interface is utilized. In this case, a multiple head assembly shall has, or is in connection widi one or more predefined mechanical interfaces: each of which supports the connection of head to head, and head to system. The said mechanical interface supports field maintenance and replacement. The mechanical interface is utilizable in a similar manner to existing print-head interfaces, such as in commercially available inkjet apparatus. It is also in die scope of the invention wherein the mechanical interface is a-thermi and supports accuracy and calibration procedures, as described above.

It is in the scope of the invention wherein software interface is used. Software is used to support a multi technology head and is configured according to both hardware configuration and the specific application. In parallel, software is used to support calibration and synchronization dtemes as defined in any of the above.

It is in the scope of the invention wherein the control mechanism interfaces the platform on a predefined interface control document (ICD) and the various modules of the multi-head components. The control is a part of operating system and calibration & maintenance system. Hence for example, the control mechanism is adapted to be responsible for scanning modules in the patterning head and sintering head; and is set to operate tn synchronizes manner with the jetting head according to the aforesaid calibration.

It is in the scope of the invention wherein the electronic system combines, communicates and integrates between a specific electronic system of each technology head; and further adapted to synchronize them. It is also in the scope of the invention wherein the electronic system interfaces with platform's electronics and interfaces the control and software components. Calibration

Reference is now made to Fig. 14, illustrating in a non-limiting and in an out-of-scale manner a calibration means and methods according to another embodiment of die invention. The multiple heads are calibratable, e.g., during assembly. The calibration is provided be calibration targets that are pre-manufactured or printed by the jetting head. The calibration is supported by the control system, electronic mechanism and software. The calibration output is saved and used by die operative software and application. It is preferable that each specific technology head has a calibration abilities and accuracy that supports calibration of the multi-technology head.

Synchronization

It is still in the scope of die invention wherein the synchronization module synchronizes technology heads internally and/or between technology heads. In an embodiment of the invention, one or more of the following are synchronized: (i) technology heads and energy sources, specifically signal generated pulses and movement of energy source, laser pulses and scanning mechanism, laser pulses and second and diird laser source; (ii) Technology heads and material feeders, specifically synchronize pulses with material existence and flow, energy pulses with height of waveguide , energy pulse with various material feeders; and (Hi) Technology heads with platform movement specifically synchronize with moving -non-moving state, specifically with predefined location and scaling based on calibration, specifically with current location according to calibration process output.

It is still in die scope of the invention wherein a system as defined in any of the above comprises a camera monitor to support registering, calibrating and monitoring of die printing, patterning and sintering process. e and refutable cartridge

It is still in the scope of the invention wherein a system as defined above the EIFT head shall be a static multi- point system which shall have a cartridge that may be disposable or refillable. Reference is now made to Fig. 20 , illustrating in a non-limiting and in an out-of-scale manner a multi-point EIFT or SL-E1FT or LD EIFT or a LIFT system were a cartridge (250) is inserted or attached to a multi-point EIFT head (25 1) thus enabling multi-point , multi-material distribution, deposition or printing of various material or materials.lt is still in the scope of the invention wherein a system with a cartridge defined above has 1 to n reservoirs (256) correlated with die 1 to n EIFT points in the EIFT head.

It is still in die scope of the invention wherein a system with a cartridge defined above each reservoir has a intermediate layer (253) and a mark or number or signature (254) identifying the EIFT point and reservoir number.

It is still in the scope of the invention wherein a system widi a cartridge defined above is aligned and connected to the EIFT head by means of alignment apparatus (255) to achieve correlation between die 1 to n EIFT points and the 1 to n cartridge resrvoirs.

It is still in the scope of the invention that the cartridge may be disposable or refillable and may be with several one type or several types of materials in die cartridges reservoirs.