Title:
ELECTRICALLY CONDUCTING POWDER, ELECTRICALLY CONDUCTING PASTE AND PROCESS FOR PRODUCTION OF LAMINATED CERAMIC ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2007/007518
Kind Code:
A1
Abstract:
According to the invention, an organic binder constituting an electrically
conducting paste is protected from rapid decomposition caused by the action
of metal powder as a catalyst in the degreasing step, whereby a sintered ceramic
constituting a baked laminated ceramic electronic component is protected from
structural failures such as cracking and delamination. An electrically conducting
powder (11) to be contained in electrically conducting pastes which has a structure
constituted of a metal powder (12) and a coat of an organic compound (13) formed
on the surface of the powder (12), wherein the compound (13) is an organic compound
which has three or more carbon atoms and contains sulfur in the molecule and the
sulfur is covalently bonded to the metal constituting the powder (12), with the
proportion of the compound (13) being 50ppm by weight or above in terms of S based
on the metal powder (12).
Inventors:
OGATA NAOAKI (JP)
NAKANO KIYOSHI (JP)
NAKANO KIYOSHI (JP)
Application Number:
PCT/JP2006/312303
Publication Date:
January 18, 2007
Filing Date:
June 20, 2006
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
OGATA NAOAKI (JP)
NAKANO KIYOSHI (JP)
OGATA NAOAKI (JP)
NAKANO KIYOSHI (JP)
International Classes:
H01B5/00; B22F1/102; H01B1/22; H01G4/12; H01G4/30
Foreign References:
| JP2004315853A | 2004-11-11 | |||
| JP2005133119A | 2005-05-26 | |||
| JP2003133165A | 2003-05-09 |
Attorney, Agent or Firm:
KOSHIBA, Masaaki (Nisshin Buiding 14-22, Shitennoji 1-chome, Tennoji-ku, Osaka-sh, Osaka 51, JP)
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