ELECTRICALLY CONDUCTIVE ADHESIVE AGENT, ELECTRICALLY CONDUCTIVE STRUCTURE, AND ELECTRONIC PART

Title:

ELECTRICALLY CONDUCTIVE ADHESIVE AGENT, ELECTRICALLY CONDUCTIVE STRUCTURE, AND ELECTRONIC PART

Document Type and Number:

WIPO Patent Application WO/2016/204162

Kind Code:

A1

Abstract:

Provided are: an electrically conductive adhesive agent which does not undergo the deterioration in electric conductivity and the fluctuations in resistivity; an electrically conductive structure; and an electronic part. The electrically conductive adhesive agent comprises (A) an organic polymer having a crosslinkable silicon group, (B) an electrically conductive filler and (C) a reducing agent.

Inventors:

OKABE YUSUKE (JP)

Application Number:

PCT/JP2016/067737

Publication Date:

December 22, 2016

Filing Date:

June 15, 2016

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Assignee:

CEMEDINE CO LTD (JP)

International Classes:

C09J201/10; C09J9/02; C09J11/04; C09J11/06; H01B1/00; H01B1/22

Domestic Patent References:

WO2012086588A1

2012-06-28

Foreign References:

JP2014185227A	2014-10-02
JPH0456064B2	1992-09-07
JP2012041393A	2012-03-01
JP2012238798A	2012-12-06
JP2009298951A	2009-12-24

Attorney, Agent or Firm:

KON SATOSHI (JP)
Now Tomoji (JP)

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