Title:
ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/031552
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electrically conductive adhesive composition which has excellent adhesive properties without containing harmful substances such as solder (lead). Specifically, this electrically conductive adhesive composition is characterized by containing (A) a thermosetting resin, (C) a filler containing a metal element, and (D) a curing agent and/or a catalyst, wherein the reaction initiation temperature of (A) and (D) is greater than or equal 180°C. Preferably, the reaction initiation temperature is greater than or equal to 200°C. Preferably, the electrically conductive adhesive composition further contains (B) flux and (E) a polymer component.
Inventors:
AOYAMA MASAMI (JP)
KIRIKAE NORIYUKI (JP)
KIRIKAE NORIYUKI (JP)
Application Number:
PCT/JP2015/072712
Publication Date:
March 03, 2016
Filing Date:
August 10, 2015
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J201/00; C09J7/30; C09J9/02; C09J11/04; C09J11/06; C09J163/00; C09J179/08; H01L21/301; H01L21/52; H01L21/60
Domestic Patent References:
| WO2014129006A1 | 2014-08-28 | |||
| WO2008023452A1 | 2008-02-28 | |||
| WO2008026517A1 | 2008-03-06 |
Foreign References:
| JP2002239785A | 2002-08-28 | |||
| JP2010059387A | 2010-03-18 | |||
| JP2012188646A | 2012-10-04 |
Other References:
See also references of EP 3187560A4
Attorney, Agent or Firm:
INOUE, SEIICHI (JP)
Seiichi Inoue (JP)
Seiichi Inoue (JP)
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