Title:
ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/181625
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an electrically conductive adhesive composition comprising a thermoplastic resin and having a high heat dissipation ability, wherein a bleed out phenomenon, i.e., exudation of a nonpolar solvent after die bonding is prevented. The present invention pertains to an electrically conductive adhesive composition which comprises (A) electrically conductive particles, (B) a thermoplastic resin, (C) a nonpolar solvent, and (D) a water-insoluble fluorine-based surfactant.
Inventors:
KOBORI KOYO (SG)
IMAI YOSHITO (SG)
ABE SHINTARO (SG)
KONDO TAKESHI (JP)
IMAI YOSHITO (SG)
ABE SHINTARO (SG)
KONDO TAKESHI (JP)
Application Number:
PCT/JP2018/013058
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
International Classes:
C09J201/00; C09J9/02; C09J11/04; C09J11/06; C09J167/00; H01B1/22; H01L21/52
Foreign References:
| JPH09501197A | 1997-02-04 | |||
| JPH11269443A | 1999-10-05 | |||
| JPH09204816A | 1997-08-05 | |||
| JP2015193865A | 2015-11-05 | |||
| JP2008110391A | 2008-05-15 | |||
| JPH067989A | 1994-01-18 | |||
| JPH09501197A | 1997-02-04 | |||
| JP2017072959A | 2017-04-13 |
Other References:
See also references of EP 3604473A4
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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