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Title:
ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND DICING/DIE-BONDING FILM USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/138254
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top of an element carrying part of a lead frame or to the top of a circuit electrode part of an insulating substrate, and is capable of forming, between the semiconductor chip and the top of the element carrying part of the lead frame or the circuit electrode part of the insulating substrate, a bonding layer which exhibits particularly excellent electrical conductivity while being lead free, and both excellent mounting reliability and heat resistance after bonding and sintering; and a dicing/die-bonding film using said electrically conductive adhesive film. This electrically conductive adhesive film includes metal particles (Q), a resin (M), and a prescribed organic phosphorus compound (A). The resin (M) includes a thermosetting resin (M1). The metal particles (Q) include at least 10 mass% of first metal particles (Q1) which have an average particle size (d50) of not more than 20 µm, and which have a fractal dimension when viewed in a projection view in a primary particle state of at least 1.1.

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Inventors:
MIHARA NAOAKI (JP)
KIRIKAE NORIYUKI (JP)
SUGIYAMA JIROU (JP)
Application Number:
PCT/JP2016/087660
Publication Date:
August 17, 2017
Filing Date:
December 16, 2016
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J7/10; C09J11/04; C09J11/06; C09J157/12; C09J161/10; C09J201/00; H01B1/00; H01B1/22; H01L21/301; H01L21/60
Domestic Patent References:
WO2013047796A12013-04-04
Foreign References:
JP2003045229A2003-02-14
JPH0788687A1995-04-04
JPH04371391A1992-12-24
JP2005276925A2005-10-06
JP2015193725A2015-11-05
JP2015516499A2015-06-11
Other References:
See also references of EP 3415578A4
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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