Title:
ELECTRICALLY CONDUCTIVE ADHESIVE, AND JOINED STRUCTURE AND ELECTRONIC COMPONENT USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/140926
Kind Code:
A1
Abstract:
Provided are: an electrically conductive adhesive which exhibits excellent adhesive properties and storage stability and which is obtained using an ultraviolet radiation-curable resin; and a joined structure and electronic component obtained using the electrically conductive adhesive. This electrically conductive adhesive contains a (meth)acrylate (A), a photopolymerization initiator (B), a phosphoric acid group-containing monomer (C), a polyester resin (D) that is soluble in an organic solvent, and electrically conductive particles (E). The phosphoric acid group-containing monomer (C) is preferably a phosphoric acid group-containing (meth)acrylate. The polyester resin (D) is preferably an amorphous polyester resin.
Inventors:
TOKUTAKE MARI (JP)
ABE SHINJI (JP)
ABE SHINJI (JP)
Application Number:
PCT/JP2020/048338
Publication Date:
July 15, 2021
Filing Date:
December 24, 2020
Export Citation:
Assignee:
NIPPON CHEMICAL IND (JP)
International Classes:
C09J4/02; C09J9/02; C09J11/04; C09J11/06; C09J167/00; H01B1/00; H01B1/20; H01B5/16
Domestic Patent References:
| WO2004001498A1 | 2003-12-31 |
Foreign References:
| JP2009147050A | 2009-07-02 | |||
| JP2012041541A | 2012-03-01 | |||
| JP2017101131A | 2017-06-08 | |||
| JPH0931416A | 1997-02-04 | |||
| JP2004043725A | 2004-02-12 |
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