ELECTRICALLY CONDUCTIVE ADHESIVE SHEET

WIPO Patent Application WO/2019/239955

A1

The problem to be solved by the present invention is to provide an electrically conductive adhesive sheet that, even in an area of an electronic substrate with an uneven surface or in bonding between rigid bodies, has good adhesiveness, conductivity in the tape thickness direction (Z-axis direction) and the tape plane direction (XY direction), and level difference following properties. The present invention relates to an electrically conductive adhesive sheet including an electrically conductive adhesive layer, wherein: the electrically conductive adhesive layer contains at least one type of electrically conductive particle; the electrically conductive particle is scale-shaped, flake-shaped, or plate-shaped; when a principal plane is the plane, in the shape of the electrically conductive particle, which has the greatest area, the thickness of the electrically conductive particle with respect to this principal plane is 0.5–6.0 µm and the proportion of the average diameter of the principal plane to the thickness of the electrically conductive particle is 10–100; and the content of the electrically conductive particles is 25–300 parts by mass with respect to 100 parts by mass of an adhesive (solid content) that forms the electrically conductive adhesive layer.

YAMASAKI MASARU (JP)
YAMAKAWA DAISUKE (JP)
YAMAKAMI AKIRA (JP)

PCT/JP2019/022109

December 19, 2019

June 04, 2019

Click for automatic bibliography generation  

DAINIPPON INK & CHEMICALS (JP)

C09J7/38; B32B27/00; B32B27/18; C09J9/02; C09J11/04; C09J133/00; C09J201/00; H01B1/00; H01B1/22; H05K9/00

JPS59152935A	1984-08-31
JPH02282401A	1990-11-20
JP2013149527A	2013-08-01
JP2009105117A	2009-05-14
JP2014112684A	2014-06-19
JP2013245234A	2013-12-09
JP2017193717A	2017-10-26
JP2015129227A	2015-07-16

OGAWA Shinji (JP)

View/Download PDF      PDF Help

Previous Patent: SHOCK ABSORBER

Next Patent: DOUBLE-SIDED ADHESIVE TAPE