Title:
ELECTRICALLY CONDUCTIVE LAMINATE MANUFACTURING METHOD, LAMINATE, AND ELECTRICALLY CONDUCTIVE LAMINATE
Document Type and Number:
WIPO Patent Application WO/2017/169612
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: an electrically conductive laminate manufacturing method capable of forming low resistance metal layers at positions corresponding to a patterned layer that is to be plated; a laminate; and an electrically conductive laminate. This electrically conductive laminate manufacturing method comprises: a step for forming on a substrate a layer for forming a layer to be plated using a specified composition for forming a layer to be plated; a step for performing a patterned exposure and development on the layer for forming a layer to be plated and forming a patterned layer to be plated that comprises portions with line widths of less than 3 µm; a step for applying a plating catalyst or precursor thereof on the patterned layer to be plated using an alkaline plating catalyst-applying solution containing a plating catalyst or precursor thereof; and a step for performing plating on the patterned layer to be plated, on which the plating catalyst or precursor thereof has been applied, using a plating solution containing aminocarboxylic acids to form a metal layer on the patterned layer to be plated.
Inventors:
HIGASHI KOHEI (JP)
KASAHARA TAKEHIRO (JP)
MURAI DAIGO (JP)
KASAHARA TAKEHIRO (JP)
MURAI DAIGO (JP)
Application Number:
PCT/JP2017/009393
Publication Date:
October 05, 2017
Filing Date:
March 09, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C23C18/20; C23C18/31; G06F3/041; G06F3/044; H05K3/18
Domestic Patent References:
| WO2016009829A1 | 2016-01-21 | |||
| WO2015056445A1 | 2015-04-23 |
Foreign References:
| JP2009212221A | 2009-09-17 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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