ELECTRICALLY CONDUCTIVE LOW-TEMPERATURE-CURABLE SILICONE ADHESIVE COMPOSITION FOR IMPROVING ELECTRICAL CONDUCTIVITY

Title:

ELECTRICALLY CONDUCTIVE LOW-TEMPERATURE-CURABLE SILICONE ADHESIVE COMPOSITION FOR IMPROVING ELECTRICAL CONDUCTIVITY

Document Type and Number:

WIPO Patent Application WO/2023/224174

Kind Code:

A1

Abstract:

The present invention relates to an electrically conductive low-temperature-curable adhesive composition. Specifically, the present invention relates to an electrically conductive thermosetting silicone adhesive composition for LED package junction, the composition being curable at a low temperature of 100°C or lower in order to attach an LED terminal to a printed circuit board (PCB), and enabling excellent electrical conductivity to be implemented after curing and, simultaneously, having the excellent effect of dissipating heat from an LED junction part to the outside thereof.

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Inventors:

BYUN SANG HYUN (KR)
HWANG DA WOOL (KR)

Application Number:

PCT/KR2022/013430

Publication Date:

November 23, 2023

Filing Date:

September 07, 2022

Export Citation:

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Assignee:

WEGLUE INC (KR)

International Classes:

C09J9/02; C08G77/00; C08G77/12; C08G77/20; C08K3/22; C08K7/18; C09J11/04; C09J183/04

Foreign References:

KR20220052107A	2022-04-27
JP2014122340A	2014-07-03
KR20220055720A	2022-05-04
KR101801728B1	2017-11-27
KR102319671B1	2021-11-01

Attorney, Agent or Firm:

SUH, Hyun et al. (KR)

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