Title:
ELECTRICALLY CONDUCTIVE PASTE, CONNECTION STRUCTURE, AND PRODUCTION METHOD FOR CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/104276
Kind Code:
A1
Abstract:
Provided is an electrically conductive paste that makes it possible to efficiently arrange solder particles upon an electrode, that makes it possible to prevent positional displacement between electrodes, and that makes it possible to increase the reliability of conduction between electrodes. This electrically conductive paste includes: as a thermosetting component, a thermosetting compound and a heat-curing agent; and a plurality of solder particles. The ratio of the viscosity of the electrically conductive paste at 80°C below the melting point of the solder particles to the viscosity of the electrically conductive paste at 30°C below the melting point of the solder particles is 1.5-4.
Inventors:
ISHIZAWA HIDEAKI (JP)
UENOYAMA SHINYA (JP)
UENOYAMA SHINYA (JP)
Application Number:
PCT/JP2015/085195
Publication Date:
June 30, 2016
Filing Date:
December 16, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; B23K35/22; B23K35/363; C09J9/02; C09J11/04; C09J201/00; H01L21/60; H01R11/01; H05K1/14; H05K3/34; H05K3/36; B23K35/26
Domestic Patent References:
| WO2008023452A1 | 2008-02-28 |
Foreign References:
| JP2010226140A | 2010-10-07 | |||
| JP2010040893A | 2010-02-18 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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