Title:
ELECTRICALLY CONDUCTIVE PASTE, ELECTRICALLY CONDUCTIVE FILM, TOUCH PANEL, AND PROCESS FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE THIN FILM
Document Type and Number:
WIPO Patent Application WO/2011/046076
Kind Code:
A1
Abstract:
Disclosed is an electrically conductive paste which can be used for the formation of an electrically conductive thin film that has significantly improved adhesion to a substrate having a transparent electrically conductive layer or the like and can impart high reliability and high electrical conductivity to the substrate. The electrically conductive paste comprises: a component (A) which is a binder resin having an acid value of 50 to 500 eq/ton and a glass transition temperature of 60 to 150˚C and comprising a polyurethane resin; a component (B) which is a metal powder; and a component (C) which is an organic solvent.
Inventors:
HAMASAKI, RYO (1-1 Katata 2-chome, Otsu-sh, Shiga 92, 〒5200292, JP)
Application Number:
JP2010/067739
Publication Date:
April 21, 2011
Filing Date:
October 08, 2010
Export Citation:
Assignee:
TOYO BOSEKI KABUSHIKI KAISHA (2-8 Dojima Hama 2-chome, Kita-ku Osaka-sh, Osaka 30, 〒5308230, JP)
東洋紡績株式会社 (〒30 大阪府大阪市北区堂島浜二丁目２番８号 Osaka, 〒5308230, JP)
東洋紡績株式会社 (〒30 大阪府大阪市北区堂島浜二丁目２番８号 Osaka, 〒5308230, JP)
International Classes:
H01B1/22; B32B9/00; B32B27/40; C09D5/24; C09D7/12; C09D175/04; C09D175/06; G06F3/041; G06F3/045; H01B5/14
Attorney, Agent or Firm:
Saegusa & Partners (Kitahama TNK Building, 1-7-1 Doshomachi, Chuo-ku, Osaka-sh, Osaka 45, 〒5410045, JP)
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