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Patent Searching and Data


Title:
ELECTRICALLY CONDUCTIVE PRESSURE SENSITIVE ADHESIVES CONTAINING NANOPARTICLE ADDITIVES
Document Type and Number:
WIPO Patent Application WO/2024/040582
Kind Code:
A1
Abstract:
Conductive adhesives include a pressure sensitive adhesive composition, electrically conductive particles dispersed within the pressure sensitive adhesive composition, and at least one nanoparticle additive dispersed within the pressure sensitive adhesive composition. The conductive adhesive is a pressure sensitive adhesive with a DC Resistance of less than or equal to 0.21 ohms as measured as a tape with a conductive backing using a PIM board and can be tested for PIM (passive intermodulation), such that the measured PIM level for the conductive adhesive is lower than the identical conductive adhesive without the additive.

Inventors:
FANG JING (CN)
HUANG JIE (CN)
HARTMANN-THOMPSON CLAIRE (US)
WHITE SHANE (US)
MCCUTCHEON JEFFREY (US)
Application Number:
PCT/CN2022/115182
Publication Date:
February 29, 2024
Filing Date:
August 26, 2022
Export Citation:
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Assignee:
3M INNOVATIVE PROPERTIES COMPANY (US)
FANG JING (CN)
International Classes:
C09J9/02; C09J7/21; C09J7/25; C09J7/28; C09J7/38; C09J133/04; C09J153/02; C09J157/02
Domestic Patent References:
WO2021124115A12021-06-24
WO2011063082A22011-05-26
Foreign References:
US20090226708A12009-09-10
US20050062024A12005-03-24
CN101525524A2009-09-09
CN106029807A2016-10-12
CN109476965A2019-03-15
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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