Title:
ELECTRICALLY CONDUCTIVE RESIN COMPOSITION, MATERIAL HAVING HIGH THERMAL CONDUCTIVITY, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/202505
Kind Code:
A1
Abstract:
This electrically conductive resin composition contains (A) silver-containing particles, (B) a (meth)acrylic compound, and (C) at least one polyfunctional epoxy compound selected from compounds represented by general formula (1).
Inventors:
KASHINO TOMOMASA (JP)
HAMASHIMA AZUMI (JP)
YOSHIDA MASATO (JP)
WATABE NAOKI (JP)
TAKAMOTO MAKOTO (JP)
HAMASHIMA AZUMI (JP)
YOSHIDA MASATO (JP)
WATABE NAOKI (JP)
TAKAMOTO MAKOTO (JP)
Application Number:
PCT/JP2022/011708
Publication Date:
September 29, 2022
Filing Date:
March 15, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08G59/20; C08K3/08; C08K5/10; C08L63/00; C09J4/02; C09J9/02; C09J163/00; H01B1/00; H01B1/22
Domestic Patent References:
| WO2022030089A1 | 2022-02-10 |
Foreign References:
| JP2008007558A | 2008-01-17 | |||
| JP2004168922A | 2004-06-17 | |||
| JPH05501783A | 1993-04-02 | |||
| JP2015160932A | 2015-09-07 | |||
| JP2016222804A | 2016-12-28 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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