Title:
ELECTRICALLY CONDUCTIVE THIN FILM STRUCTURE, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2011/043367
Kind Code:
A1
Abstract:
Disclosed is an electrically conductive thin film structure exhibiting better quality than conventional electrically conductive thin film structures. An electrically conductive thin film structure (5) is equipped with a substrate (1), a fine wire structure (2) formed on top of the substrate (1), and a transparent electrode (3) formed on top of the substrate (1) so as to cover the fine wire structure (2). The fine wire structure (2) and the transparent electrode (3) are continuously formed by gravure offset printing on the substrate (1) using gravure rolls (21,31) and offset rolls (22,32). The surfaces of the offset rolls (22,32) are each covered with a blanketing material (22a,32a).
Inventors:
SAKAMOTO Koji (8-11, Yamanouchi 3-chome, Sumiyoshi-ku, Osaka-sh, Osaka 23, 〒5580023, JP)
Application Number:
JP2010/067525
Publication Date:
April 14, 2011
Filing Date:
October 06, 2010
Export Citation:
Assignee:
SAKAMOTO Jun (8-11, Yamanouchi 3-chome, Sumiyoshi-ku, Osaka-sh, Osaka 23, 〒5580023, JP)
阪本 順 (〒23 大阪府大阪市住吉区山之内３丁目８番１１号 鷹羽産業株式会社内 Osaka, 〒5580023, JP)
阪本 順 (〒23 大阪府大阪市住吉区山之内３丁目８番１１号 鷹羽産業株式会社内 Osaka, 〒5580023, JP)
International Classes:
H01B5/14; H01B13/00
Attorney, Agent or Firm:
MAEI Hiroyuki (5th Floor, ELGALLANT Hiranomachi Building 5-11, Hiranomachi 1-chome, Chuo-ku, Osaka-sh, Osaka 46, 〒5410046, JP)
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