Title:
ELECTRICALLY HEATABLE PRESSURE-SENSITIVE ADHESIVE COMPOUND
Document Type and Number:
WIPO Patent Application WO2004081095
Kind Code:
A8
Abstract:
The invention relates to an electrically heatable pressure-sensitive adhesive compound, to a method for the production thereof and to its use for producing pressure-sensitive adhesive tapes. The inventive pressure-sensitive adhesive compound comprises: (a) at least one adhesive constituent, in particular, based on an acrylate constituent, and; (b) at least one electrically conductive filler, particularly conductive carbon black. The preferably highly-crosslinked pressure-sensitive adhesive compound exhibits a high electrically induced heatability and is suited for producing pressure-sensitive adhesive tapes for adhering PTC elements.
Inventors:
HUSEMANN MARC (DE)
ZOELLNER STEPHAN (DE)
WESTPHAL ANDREAS (DE)
ZOELLNER STEPHAN (DE)
WESTPHAL ANDREAS (DE)
Application Number:
PCT/EP2004/001538
Publication Date:
November 04, 2004
Filing Date:
February 18, 2004
Export Citation:
Assignee:
TESA AG (DE)
HUSEMANN MARC (DE)
ZOELLNER STEPHAN (DE)
WESTPHAL ANDREAS (DE)
HUSEMANN MARC (DE)
ZOELLNER STEPHAN (DE)
WESTPHAL ANDREAS (DE)
International Classes:
B60R1/06; C09J7/10; C09J9/02; C09J11/04; C09J133/06; H01C7/02; C08L33/00; (IPC1-7): C09J201/00; C09J133/06
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