ELECTRICALLY INSULATING RESIN COMPOSITION AND ELECTRICALLY INSULATING BODY

Title:

ELECTRICALLY INSULATING RESIN COMPOSITION AND ELECTRICALLY INSULATING BODY

Document Type and Number:

WIPO Patent Application WO/2020/136827

Kind Code:

A1

Abstract:

An electrically insulating resin composition which contains: a polyamide imide resin that has a number average molecular weight of from 17,000 to 23,000 and an acid value of from 30 mgKOH/g to 50 mgKOH/g; and inorganic particles.

Inventors:

SHIKE SEIICHI (JP)
HIRAI TOMOKI (JP)
TABATA SHIORI (JP)
ISHII SHUUSUKE (JP)
SAOTOME TAKEHIKO (JP)

Application Number:

PCT/JP2018/048240

Publication Date:

July 02, 2020

Filing Date:

December 27, 2018

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

C08K3/36; H01B3/30; C08L79/08; H01B7/02

Foreign References:

JP2006302835A	2006-11-02
JP2017101197A	2017-06-08
JP2012241052A	2012-12-10
JP2002348470A	2002-12-04

Attorney, Agent or Firm:

MIYOSHI Hidekazu et al. (JP)

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