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Patent Searching and Data


Title:
ELECTRICALLY-INSULATING RESIN COMPOSITION AND ELECTRICAL INSULATOR
Document Type and Number:
WIPO Patent Application WO/2020/240822
Kind Code:
A1
Abstract:
Provided is an electrically-insulating resin composition containing a polyamide-imide resin and silica fine particles, wherein the content of the silica fine particles based on the total mass of the solid content is 6-24 mass%. By using said electrically-insulating resin composition, it is possible to provide an electrical insulator having excellent withstand voltage life characteristics against a surge voltage.

Inventors:
HIRAI TOMOKI (JP)
TABATA SHIORI (JP)
SHIKE SEIICHI (JP)
ISHII SHUUSUKE (JP)
Application Number:
PCT/JP2019/021733
Publication Date:
December 03, 2020
Filing Date:
May 31, 2019
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01B3/30; C08K3/36; C08L79/08; H01B7/02
Foreign References:
JP2016015295A2016-01-28
JP2011207955A2011-10-20
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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