Title:
ELECTRICALLY PEELABLE PRESSURE-SENSITIVE ADHESIVE ARTICLE AND METHOD FOR PEELING OFF SAME
Document Type and Number:
WIPO Patent Application WO/2011/024551
Kind Code:
A1
Abstract:
An electrically peelable pressure-sensitive adhesive article which is provided with an electrically conductive support, an electrically peelable pressure-sensitive adhesive layer formed thereon, and an electrically conductive layer formed on the surface of the electrically peelable pressure-sensitive adhesive layer, said electrically peelable pressure-sensitive adhesive layer consisting of an electrically peelable pressure-sensitive adhesive composition which comprises both an acrylic or polyester pressure-sensitive adhesive and an electrolytic solution, wherein the electrically peelable pressure-sensitive adhesive composition has an ionic conductivity of 10-11 to 10-3S/cm; the electrolytic solution is an organic solution that comprises both an organic solvent and an electrolyte selected from among organic quaternary ammonium salts and inorganic alkali metal salts; the electrolytic solution is contained in the electrically peelable pressure-sensitive adhesive layer in an amount of 15 to 250 parts by weight per 100 parts by weight of the acrylic or polyester pressure-sensitive adhesive; the electrolyte is contained in the electrolytic solution in a concentration of 0.01 to 3mol/l; and the electrically conductive layer has a patterned planar shape that includes openings where the electrically peelable pressure-sensitive adhesive layer is exposed.
Inventors:
AOKI, Takahiro (166-17, Oazashiroyamadai, Gose-sh, Nara 61, 〒6392261, JP)
Application Number:
JP2010/060867
Publication Date:
March 03, 2011
Filing Date:
June 25, 2010
Export Citation:
Assignee:
VIGteQnos co.,ltd. (166-17, Oazashiroyamadai Gose-sh, Nara 61, 〒6392261, JP)
ビッグテクノス株式会社 (〒61 奈良県御所市大字城山台１６６－１７ Nara, 〒6392261, JP)
ビッグテクノス株式会社 (〒61 奈良県御所市大字城山台１６６－１７ Nara, 〒6392261, JP)
International Classes:
C09J133/00; B32B3/14; B32B27/00; B32B27/30; B32B27/36; C09J9/02; C09J167/00
Attorney, Agent or Firm:
NOGAWA, Shintaro (Nogawa Patent Office, Nishitenma Five Bldg. 16-3, Nishitenma 5-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)