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Patent Searching and Data


Title:
ELECTROCONDUCTIVE ADHESIVE COMPOSITION AND CONNECTION STRUCTURE USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/013333
Kind Code:
A1
Abstract:
Disclosed is an electroconductive adhesive composition that is used for electrically connecting a circuit board and a semiconductor light-emitting element mounted on the circuit board, the electroconductive adhesive composition comprising: (A) electroconductive particles including a metal having a melting point of 230°C or lower; (B) hydrogenated bisphenol A diglycidyl ether; (C) a flux activator including a compound including a hydroxyl group and a carboxyl group; and (D) a curing accelerator.

Inventors:
SUKATA SHINICHIROU (JP)
YOKOCHI SEIGO (JP)
Application Number:
PCT/JP2018/026537
Publication Date:
January 17, 2019
Filing Date:
July 13, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J163/02; C09J9/02; C09J11/04; C09J11/06; H01B1/22; H01L33/62; H01R11/01
Foreign References:
JP2016014115A2016-01-28
JP2017112312A2017-06-22
JP2011100927A2011-05-19
JP2008510620A2008-04-10
JP2008510621A2008-04-10
JP2015053342A2015-03-19
JP2007182562A2007-07-19
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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