Title:
ELECTROCONDUCTIVE ADHESIVE COMPOSITION AND CONNECTION STRUCTURE USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/013336
Kind Code:
A1
Abstract:
Disclosed is an electroconductive adhesive composition comprising (A) electroconductive particles, (B) a thermosetting resin, (C) a flux activator, and (D) a curing catalyst. The electroconductive particles include a metal having a melting point of 200°C or lower. The average particle size of the electroconductive particles is from 0.01 to 10 µm. The flux activator includes a compound including a hydroxyl group and a carboxyl group. The electroconductive adhesive composition is used for electrically connecting a circuit board 2 and an electronic component 3 mounted on the circuit board 2.
Inventors:
SUKATA SHINICHIROU (JP)
YOKOCHI SEIGO (JP)
YOKOCHI SEIGO (JP)
Application Number:
PCT/JP2018/026548
Publication Date:
January 17, 2019
Filing Date:
July 13, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J9/02; C09J11/04; C09J11/06; H01B1/22; H01R11/01
Foreign References:
| JP2016014115A | 2016-01-28 | |||
| JP2015053342A | 2015-03-19 | |||
| JP2017112312A | 2017-06-22 | |||
| JP2007182562A | 2007-07-19 | |||
| JP2008510620A | 2008-04-10 | |||
| JP2008510621A | 2008-04-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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