ELECTROCONDUCTIVE ADHESIVE COMPOSITION

Title:

ELECTROCONDUCTIVE ADHESIVE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2016/002780

Kind Code:

A1

Abstract:

Provided is an electroconductive adhesive composition having at least: a polyurethane polyurea resin (F) obtained by reacting a polyamino compound (E) and a urethane prepolymer (D) obtained by reacting a polyol compound (A), a diisocyanate compound (B), and a diol compound (C) having a carboxyl group; an epoxy resin (G) having two or more epoxy groups; and an electroconductive filler (H); the polyurethane polyurea resin (F) being a polyurethane polyurea resin (F-1) having an acid value of 1-6 mg KOH/g and a polyurethane polyurea resin (F-2) having an acid value of 18-30 mg KOH/g.

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Inventors:

YAMAMOTO YOSHIHISA (JP)
IWAI KIYOSHI (JP)

Application Number:

PCT/JP2015/068832

Publication Date:

January 07, 2016

Filing Date:

June 30, 2015

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Assignee:

TATSUTA DENSEN KK (JP)

International Classes:

C09J175/04; C09J7/20; C09J9/02; C09J11/02; C09J163/00; H05K1/03

Foreign References:

JP2010143981A	2010-07-01
JP2011166100A	2011-08-25

Attorney, Agent or Firm:

KAWAGUCHI, Yoshiyuki et al. (JP)
Yoshiyuki Kawaguchi (JP)

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