Title:
ELECTROCONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/013231
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electroconductive adhesive composition which has excellent thermal conductivity and which, even when repeatedly undergoing fluctuations in temperature, is inhibited from causing adherend separation. The present invention relates to an electroconductive adhesive composition which comprises: an electroconductive filler (A) comprising metal particles (a1) having an average particle diameter of 0.5-10 μm and silver particles (a2) having an average particle diameter of 10-200 nm; and particles (B) of a thermoplastic resin which is solid at 25°C.
Inventors:
KOBORI KOYO (SG)
IMAI YOSHITO (SG)
ABE SHINTARO (JP)
KONDO TAKESHI (JP)
IMAI YOSHITO (SG)
ABE SHINTARO (JP)
KONDO TAKESHI (JP)
Application Number:
PCT/JP2018/026104
Publication Date:
January 17, 2019
Filing Date:
July 10, 2018
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
International Classes:
C09J201/00; C09J9/02; C09J11/04; H01B1/00; H01B1/22
Domestic Patent References:
| WO2016063931A1 | 2016-04-28 |
Foreign References:
| JP2015162392A | 2015-09-07 | |||
| JP5872545B2 | 2016-03-01 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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