Title:
ELECTROCONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2012/086588
Kind Code:
A1
Abstract:
Provided is an electroconductive adhesive which exhibits excellent electroconductivity and adhesiveness and which can be inhibited from settling or bleeding and exhibits excellent electroconductivity stability. This electroconductive adhesive comprises (A) an organic polymer which contains, as the backbone skeleton, one or more polymers selected from the group consisting of polyoxyalkylene polymers, saturated hydrocarbon polymers and (meth)acrylate polymers and which has a crosslinking silicon group, (B) a silver powder which comprises (b1) a first silver powder having a specific surface area of 0.5 to less than 2m2/g and a tap density of 2.5 to 6.0g/cm3 and (b2) a second silver powder having a specific surface area of 2 to 7m2/g and a tap density of 1.0 to 3.0g/cm3 at a prescribed mixing ratio, and (C) an at least one kind of silica selected from the group consisting of hydrophobic silica hydrophobized with a specific surface treatment and hydrophilic silica.
Inventors:
OKABE YUSUKE (JP)
SAITO ATSUSHI (JP)
SAITO ATSUSHI (JP)
Application Number:
PCT/JP2011/079363
Publication Date:
June 28, 2012
Filing Date:
December 19, 2011
Export Citation:
Assignee:
CEMEDINE CO LTD (JP)
OKABE YUSUKE (JP)
SAITO ATSUSHI (JP)
OKABE YUSUKE (JP)
SAITO ATSUSHI (JP)
International Classes:
C09J201/10; C09J9/02; C09J11/04; C09J123/00; C09J133/04; C09J171/00; C09J183/04; H01B1/00; H01B1/22
Foreign References:
| JPH0456064B2 | 1992-09-07 | |||
| JP2003147279A | 2003-05-21 | |||
| JP2002161123A | 2002-06-04 | |||
| JP2005113059A | 2005-04-28 | |||
| JP2003327943A | 2003-11-19 | |||
| JP2004339325A | 2004-12-02 | |||
| JPS63245484A | 1988-10-12 | |||
| JPH03170581A | 1991-07-24 | |||
| JP2005054157A | 2005-03-03 | |||
| JP2000053733A | 2000-02-22 | |||
| JP2000319622A | 2000-11-21 | |||
| JP2006073812A | 2006-03-16 | |||
| JP2539445B2 | 1996-10-02 | |||
| JPH0581923A | 1993-04-02 |
Attorney, Agent or Firm:
ISHIHARA, Shinsuke et al. (JP)
Shinsuke Ishihara (JP)
Shinsuke Ishihara (JP)
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Claims: