Title:
ELECTROCONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2017/204238
Kind Code:
A1
Abstract:
Provided is an electroconductive adhesive which is less apt to suffer cracking, chipping, etc. upon sintering and gives sintered objects having excellent mechanical strength.
The electroconductive adhesive comprises metallic microparticles which include a protective layer comprising one or more amines and have an average particle diameter of 30-300 nm,
the amines comprising a C5-7 monoalkylamine and/or an alkoxyamine represented by the following general formula (1).
NH2-R2-O-R1 (1)
In the protective layer, the ratio of the C5-7 monoalkylamine and/or alkoxyamine represented by the general formula (1) to one or more amines different therefrom is in the range of 100:0 to 10:90.
[In formula (1), R1 represents a C1-4 alkyl group and R2 represents a C1-4 alkylene group.]
Inventors:
MORI TAKAMICHI (JP)
MINAMI JUNICHIRO (JP)
IWASA NARUHITO (JP)
MINAMI JUNICHIRO (JP)
IWASA NARUHITO (JP)
Application Number:
PCT/JP2017/019311
Publication Date:
November 30, 2017
Filing Date:
May 24, 2017
Export Citation:
Assignee:
OSAKA SODA CO LTD (JP)
International Classes:
C09J1/00; C09J9/02; C09J11/06; H01B1/00; H01B1/22; H01L21/52
Domestic Patent References:
| WO2013061527A1 | 2013-05-02 | |||
| WO2012133767A1 | 2012-10-04 | |||
| WO2016125737A1 | 2016-08-11 |
Foreign References:
| JP2010275580A | 2010-12-09 | |||
| JP2015224263A | 2015-12-14 | |||
| JP2016054098A | 2016-04-14 | |||
| JP2013214733A | 2013-10-17 |
Other References:
See also references of EP 3467062A4
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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