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Title:
ELECTROCONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2019/077909
Kind Code:
A1
Abstract:
An electroconductive adhesive comprising a binder resin 102 and an electroconductive filler 103. The electroconductive filler 103 has a 10%-cumulative circularity of 0.50-0.65 and a 10%-cumulative solidity of 0.50-0.70.

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Inventors:
KAMINO KENJI (JP)
Application Number:
PCT/JP2018/033458
Publication Date:
April 25, 2019
Filing Date:
September 10, 2018
Export Citation:
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Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09J7/20; C09J201/00; C09J7/35; C09J9/02; H01B1/22; H05K1/02; H05K9/00
Domestic Patent References:
WO2016186099A12016-11-24
WO2017010101A12017-01-19
WO2017164174A12017-09-28
Foreign References:
JP2015097240A2015-05-21
JP2011166100A2011-08-25
JP2018129498A2018-08-16
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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