Title:
ELECTROCONDUCTIVE BONDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/034863
Kind Code:
A1
Abstract:
An electroconductive bonding material, which has high bonding strength with inorganic non-metals such as glass or ceramics, which does not peel even when subjected to high temperatures, and which is highly reliable, contains the following elements in mass %: Zn: 0.1 to 15%, In: 2 to 16%, Sb: more than 0% and 2% or less; and depending on the situation, also Ag: 2% and/or Cu: 1% or less, at least one selected from the group consisting of Ba, Ti, and Ca for a total of 0.01 to 0.15%, and the remainder being an alloy composition of Sn. By being heated to or above the melting point, the electroconductive bonding material can be peeled off and reused.
Inventors:
UESHIMA MINORU (JP)
OHSAWA ISAMU (JP)
OHSAWA ISAMU (JP)
Application Number:
PCT/JP2013/073356
Publication Date:
March 06, 2014
Filing Date:
August 30, 2013
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; B23K1/19; C22C13/00; C22C13/02; H01B1/02; H05K3/34
Foreign References:
| JP2011031253A | 2011-02-17 | |||
| JP2008030047A | 2008-02-14 | |||
| JP2004082199A | 2004-03-18 | |||
| JP2000141078A | 2000-05-23 |
Other References:
See also references of EP 2891538A4
None
None
Attorney, Agent or Firm:
HIROSE SHOICHI (JP)
Hirose Shoichi (JP)
Hirose Shoichi (JP)
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