Title:
ELECTROCONDUCTIVE COMPOSITION, ELECTROCONDUCTIVE PASTE, ELECTRIC CIRCUIT, FLEXIBLE ELECTRIC-CIRCUIT OBJECT, AND METHOD FOR PRODUCING MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2022/153925
Kind Code:
A1
Abstract:
Provided is an electroconductive composition capable of forming electric wiring lines in an electric circuit that are less apt to break even when the electric circuit and/or the electric wiring lines are elongated and/or flexed. The electroconductive composition comprises (A) electroconductive particles, (B) a thermoplastic resin, and (C) a solvent, wherein the thermoplastic resin (B) has a glass transition point of 140-200°C.
Inventors:
OGIWARA TOSHIAKI (JP)
FUJINO TAKU (JP)
FUJINO TAKU (JP)
Application Number:
PCT/JP2022/000294
Publication Date:
July 21, 2022
Filing Date:
January 07, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L101/12; C08K3/08; C08L69/00; H05K1/09
Domestic Patent References:
| WO2017170079A1 | 2017-10-05 | |||
| WO2021002278A1 | 2021-01-07 | |||
| WO2019039209A1 | 2019-02-28 |
Foreign References:
| JP2011063791A | 2011-03-31 | |||
| JP2017126771A | 2017-07-20 | |||
| JP2019139923A | 2019-08-22 | |||
| JP2018041692A | 2018-03-15 | |||
| JP2020055918A | 2020-04-09 | |||
| JP2016204628A | 2016-12-08 | |||
| JP2019189680A | 2019-10-31 | |||
| JP2018104581A | 2018-07-05 | |||
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| US20170200527A1 | 2017-07-13 | |||
| JP2014531490A | 2014-11-27 | |||
| JP2018104581A | 2018-07-05 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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