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Title:
ELECTROCONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS TO EACH OTHER USING THE ELECTROCONDUCTIVE CONNECTING MATERIAL, AND METHOD FOR MANUFACTURING CONNECTING TERMINAL
Document Type and Number:
WIPO Patent Application WO/2010/027017
Kind Code:
A1
Abstract:
Disclosed is an electroconductive connecting material that electrically connects terminals for respective electronic members to each other.  The electroconductive connecting material has a laminate structure comprising a curable resin composition containing a resin component and a compound having a flux function and a metal foil selected from a solder foil or a tin foil.  Also disclosed is a method for connecting terminals to each other.  The method comprises a placement step of placing the electroconductive connecting material between opposed terminals, a heating step of heating the electroconductive connecting material at a temperature which is at or above the melting point of the metal foil and at which the curing of the resin composition is not completed or the resin composition is softened, and a curing/solidifying step of curing or solidifying the resin composition.

Inventors:
OKADA WATARU (JP)
YAMAMOTO MICHINORI (JP)
CHUMA TOSHIAKI (JP)
MAEJIMA KENZO (JP)
KAGIMOTO TOMOHIRO (JP)
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
Application Number:
PCT/JP2009/065414
Publication Date:
March 11, 2010
Filing Date:
September 03, 2009
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
OKADA WATARU (JP)
YAMAMOTO MICHINORI (JP)
CHUMA TOSHIAKI (JP)
MAEJIMA KENZO (JP)
KAGIMOTO TOMOHIRO (JP)
KATSURAYAMA SATORU (JP)
YAMASHIRO TOMOE (JP)
International Classes:
C09J7/00; H05K3/34; C09J9/02; C09J11/06; C09J163/02; C09J201/00; H01R11/01
Domestic Patent References:
WO2005081602A12005-09-01
Foreign References:
JP2005203693A2005-07-28
JP2000332393A2000-11-30
JP2008111990A2008-05-15
JPS61276873A1986-12-06
JP2004260131A2004-09-16
Other References:
M. R. KAMAL, S. SOUROUR: "Kinetics and Thermal Characterization of Thermoset Cure", POLYMER ENGINEERING AND SCIENCE, vol. 13, no. I, January 1973 (1973-01-01)
J. M. CASTRO, C. W. MACOSKO: "Studies of Mold Filling and Curing in the Reaction Injection Molding Process", AICHE JOURNAL, vol. 28, no. 2
See also references of EP 2357876A4
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
Kobayashi 浩 (JP)
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