Title:
ELECTROCONDUCTIVE FILM AND ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2014/083875
Kind Code:
A1
Abstract:
The present invention relates to an electroconductive film (including electromagnetic wave shielding films) and provides a novel electroconductive film that not only has excellent conductivity but also is capable of increased adhesiveness. A press bonding electroconductive film provided with a resin layer (A) in which electroconductive particles that have rods are contained in a B-stage resin layer is proposed.
Inventors:
OTA KOYU (JP)
SYOUJIGUCHI TAKASHI (JP)
SYOUJIGUCHI TAKASHI (JP)
Application Number:
PCT/JP2013/067864
Publication Date:
June 05, 2014
Filing Date:
June 28, 2013
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B27/18; C09J7/10; C09J9/02; C09J11/04; C09J201/10; H01B5/00; H01B5/16; H01L23/00; H05K9/00
Domestic Patent References:
| WO2001064807A1 | 2001-09-07 | |||
| WO2012164925A1 | 2012-12-06 |
Foreign References:
| JP2010150362A | 2010-07-08 | |||
| JP2005146044A | 2005-06-09 | |||
| JP2003045229A | 2003-02-14 | |||
| JP2001240816A | 2001-09-04 |
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
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