Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTROCONDUCTIVE FILM FORMATION COMPOSITION AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2019/189251
Kind Code:
A1
Abstract:
This electroconductive film formation composition contains flat metal particles and a resin. The flat metal particles have a metal oxide layer on the surface part thereof. The flat metal particles are such that the ratio of the thickness of the metal oxide layer relative to the thickness of the particles is 0.010 to 0.300 inclusive. The metal oxide layer has a thickness of 0.010 μm to 2.000 μm inclusive. In this method for manufacturing an electroconductive film, an electroconductive film formation composition containing flat metal particles and a resin is used. The electroconductive film formation composition is applied onto a substrate and a coating is formed; then, the coating is irradiated with light and fired, whereby an electroconductive film is obtained. The flat metal particles have a metal oxide layer on the surface part thereof.

Inventors:
ANAI KEI (JP)
FUKUZATO SHUN (JP)
Application Number:
JP2019/012986
Publication Date:
October 03, 2019
Filing Date:
March 26, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H01B1/22; C09D5/24; C09D7/61; C09D201/00; H01B1/00; H01B5/14; H01B13/00
Foreign References:
JP2017123253A2017-07-13
JP2016196705A2016-11-24
JP2014011412A2014-01-20
JP2003119501A2003-04-23
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
Download PDF: