ELECTROCONDUCTIVE-FILM-FORMING COMPOSITION AND METHOD FOR PRODUCING ELECTROCONDUCTIVE FILM

Title:

ELECTROCONDUCTIVE-FILM-FORMING COMPOSITION AND METHOD FOR PRODUCING ELECTROCONDUCTIVE FILM

Document Type and Number:

WIPO Patent Application WO/2015/015918

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide: an electroconductive-film-forming composition that can form an electroconductive film having excellent electroconductivity and few voids; and a method for producing an electroconductive film by using said composition. This electroconductive-film-forming composition comprises: copper particles having an average particle diameter of from 1 nm to 10 µm; copper oxide particles having an average particle diameter of from 1 to 500 nm; a reducing agent having a hydroxy group; a metal catalyst including a metal other than copper; and a solvent. The content of said copper oxide particles is from 50 to 300 mass% with respect to the content of said copper particles. The content of said reducing agent is from 100 to 800 mol% with respect to the content of said copper oxide particles. The content of said metal catalyst is 10 mass% or less with respect to the content of said copper oxide particles.

Inventors:

TSUYAMA HIROAKI (JP)
WATANABE TORU (JP)
HAYATA YUUICHI (JP)

Application Number:

PCT/JP2014/065569

Publication Date:

February 05, 2015

Filing Date:

June 12, 2014

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

C09D201/00; C09D1/00; C09D5/24; C09D7/12; H01B1/00; H01B1/22; H01B13/00; H05K1/09; H05K3/12

Domestic Patent References:

WO2003051562A1	2003-06-26
WO2010047350A1	2010-04-29
WO2014119498A1	2014-08-07
WO2014050466A1	2014-04-03
WO2003051562A1	2003-06-26

Foreign References:

JP2007080720A	2007-03-29
JP2008166590A	2008-07-17
JP2000315421A	2000-11-14
JPH01282178A	1989-11-14
JPS63257107A	1988-10-25
JPH10204150A	1998-08-04
JPH024150A	1990-01-09
JP2003222993A	2003-08-08

Other References: