Title:
ELECTROCONDUCTIVE FILM PATTERN AND METHOD FOR FORMING AN ELECTROCONDUCTIVE FILM PATTERN
Document Type and Number:
WIPO Patent Application WO/2010/134536
Kind Code:
A1
Abstract:
Disclosed are an electroconductive film pattern and a method for forming the same, in which an electroconductive film pattern having superior variations in film thickness and surface planarity, and satisfactory adhesion to a substrate is formed without the need for complex and expensive equipment and processes. The electroconductive film pattern is formed by placing ink containing fine metallic particles on a substrate and carrying out sintering, and the ink exhibits positive (or negative) zeta potential. A primer layer having a negative (or positive) charge is formed on the surface of the substrate where the ink is placed.
Inventors:
YANATA Atsuro (Inc. 1, Sakura-machi, Hino-sh, Tokyo 11, 〒1918511, JP)
Application Number:
JP2010/058415
Publication Date:
November 25, 2010
Filing Date:
May 19, 2010
Export Citation:
Assignee:
Konica Minolta Holdings, Inc. (6-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 05, 〒1000005, JP)
コニカミノルタホールディングス株式会社 (〒05 東京都千代田区丸の内一丁目６番１号 Tokyo, 〒1000005, JP)
コニカミノルタホールディングス株式会社 (〒05 東京都千代田区丸の内一丁目６番１号 Tokyo, 〒1000005, JP)
International Classes:
H01B5/14; H01B13/00; H05K3/10; H05K3/38
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