Title:
ELECTROCONDUCTIVE INK AND METHOD OF MANUFACTURING ELECTROCONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/221181
Kind Code:
A1
Abstract:
The present invention provides an electroconductive ink capable of yielding an electroconductive film of superior film thickness uniformity and suppressed crack formation. This electroconductive ink contains colloidal silver particles, water, and diethylene glycol monoisobutyl ether. The colloidal silver particles comprise silver nanoparticles and a dispersant constituted by a hydroxy acid or salt thereof comprising COOH radicals and OH radicals, the number of COOH radicals being equal to or greater than the number of OH radicals. The electroconductive ink preferably also contains a glycol ether other than the diethylene glycol monoisobutyl ether.
Inventors:
EDAGAWA ASAKO (JP)
TOMURA TAKUYA (JP)
TOMURA TAKUYA (JP)
Application Number:
PCT/JP2018/018532
Publication Date:
December 06, 2018
Filing Date:
May 14, 2018
Export Citation:
Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
C09D11/52; C09D11/30; H01B1/22
Foreign References:
| JP2008214591A | 2008-09-18 | |||
| JP2012140558A | 2012-07-26 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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