Title:
ELECTROCONDUCTIVE JOINING MATERIAL, JOINING MEMBER EQUIPPED WITH SAID ELECTROCONDUCTIVE JOINING MATERIAL, AND JOINING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/157125
Kind Code:
A1
Abstract:
The present invention relates to a joining method involving the application of a predetermined electroconductive joining material. This electroconductive joining material is characterized by comprising a metal powder molded body wherein the metal powder is one or more types selected from the group consisting of gold powder, silver powder, platinum powder, and palladium powder, having a purity of 99.9% by mass or more and a mean particle size of 0.005 μm to 1.0 μm, and having a compressive deformation rate M, as indicated by the formula, of 5% to 30% upon compression at a compressive force of 5 MPa. A joining member comprising at least one unit of the electroconductive joining material formed on a base material is used, thereby allowing the joining step to be more efficient. M = {(h1-h2)/h1} × 100
h1: mean thickness of electroconductive joining material before compression
h2: mean thickness of electroconductive joining material after compression
Inventors:
OGASHIWA TOSHINORI (JP)
UEDA KAZUO (JP)
UEDA KAZUO (JP)
Application Number:
PCT/JP2020/036541
Publication Date:
August 12, 2021
Filing Date:
September 28, 2020
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
International Classes:
B22F1/00; B22F7/08; H01L21/52
Domestic Patent References:
| WO2017195399A1 | 2017-11-16 |
Foreign References:
| JP2012060114A | 2012-03-22 | |||
| JP2019079883A | 2019-05-23 | |||
| JP2017520907A | 2017-07-27 | |||
| JP2018206826A | 2018-12-27 | |||
| JP2019173165A | 2019-10-10 | |||
| JP2013096008A | 2013-05-20 | |||
| JP2014067917A | 2014-04-17 | |||
| JP2007324523A | 2007-12-13 |
Other References:
See also references of EP 4086021A4
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
Download PDF: